Protection Devices Safeguard 3G/CDMA Phones from Increased EMI and ESD Threats
Semtech has announced the EClamp™237xP family of devices designed to protect against the increased risk of electrostatic discharge (ESD) and increased levels of electromagnetic interference (EMI) and radio frequency interference (RFI) in 3G and CDMA phones that have high-resolution displays and video and digital camera features.As m
The new EClamp237xP family includes the four-line EClamp2374P, the six-line EClamp2376P and the eight-line EClamp2378P. The devices feature a TVS diode on each line for ESD protection and a resistor-capacitor network for EMI/RFI filtering. All models of the EClamp237xP family feature low series resistance of 100 ohms combined with a capacitance of 20pF to deliver more than 30dB of attenuation from 1.8GHz to 2.5GHz.
The devices in the EClamp237xP family all feature very low clamping voltage to protect the sensitive baseband controller. The devices are designed to protect and filter high-speed parallel interfaces that operate at speeds up to 60Mbs without signal degradation.
The EClamp237xP devices are packaged in the Semtech Leadless Package (SLP) that has the narrow form factor and manufacturing durability to replace “flip chip” based alternatives. All devices in the family feature a uniform narrow 1.6 mm width, and a uniform low 0.6 mm profile but differ in length depending upon the number of lines the device supports.
The EClamp237xP devices also feature a flow through design that alleviates the need for signal routing for a faster and more convenient layout. EClamp237xP devices are RoHS/WEEE compliant to meet worldwide environmental and regulatory requirements.
EClamp237xP devices are available immediately in production quantities and are priced from $0.25 each to $0.45 each in 10,000-piece lots. Ordering codes are EClamp2374P.TCT for the four-line version, EClamp2376P.TCT for the six-line version and EClamp2378P.TCT for the eight-line version.
26th July 2023
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