Capacitors enable design of thinner end products
The T55 series of vPolyTan surface-mount polymer tantalum moulded chip capacitors from Vishay Intertechnology has been extended with devices in the Z case (EIA 7343-19) size. With a 0.1mm lower height than devices in the standard V case (EIA 7343-20), the Vishay Polytech capacitors increase package density and enable the design of thinner end products.
The devices are optimised for power management, battery decoupling, and energy storage in computers, servers, network infrastructure equipment, solid-state drives, and wireless transceivers.
Offered in the compact J, P, A, B, T (low-profile B — 1.2mm max), D, V, and Z case sizes, the components feature a wide capacitance range from 3.3µF to 680µF over voltage ratings from 2.5 V to 63 V, and a capacitance tolerance of ± 20%.
They provide ultra-low ESR from 500mΩ down to 7mΩ at +25°C, a result of their polymer cathodes, which offer greatly enhanced performance over manganese dioxide devices. Capacitance values up to 1000µF and ESR values down to 6mΩ are in development.
Operating over a temperature range of -55°C to +105°C, the capacitors offer excellent ripple current rating up to 5.66A IRMS and provide low internal resistance for enhanced charge and discharge characteristics.
Featuring lead (Pb)-free terminations, the T55 series is RoHS-compliant, halogen-free, and Vishay Green. The devices are compatible with high volume automatic pick and place equipment and offer a Moisture Sensitivity Level (MSL) of 3.
Samples and production quantities of the T55 series capacitors in the Z case size are available now, with lead times of 12 to 14 weeks.