SIP DAQ integrates signal processing, conditioning blocks
Utilising system-in-package (SIP) technology, the ADAQ23875 integrates multiple common signal-processing and conditioning blocks into a single device, reducing end system component count and development cycles of precision measurement systems.
The DAQ integrates a low-noise, fully differential analogue-to-digital converter (ADC) driver; a stable reference buffer; and a high-speed 16-bit, 15 MSPS successive approximation register (SAR) ADC.
It also incorporates Analog Devices' iPassivestechnology, supplying crucial passive components with superior matching and drift characteristics, to minimise temperature dependent error sources through optimised performance.
Fast settling of the ADC driver stage, with fully differential or single-ended to differential input and no latency of the SAR ADC, provides a unique solution for high-channel-count multiplexed signal chain architectures and control loop applications.
The ADAQ23875 comes in a 9 mm × 9 mm package, four times smaller than its discrete equivalent, enabling smaller-form-factor instruments without sacrificing performance.
It features a serial low-voltage differential-signalling (LVDS) digital interface with one-lane or two-lane output modes, allowing the user to optimise the interface data rate for each application.
The ADAQ23875 is supported by the EVAL-ADAQ23875FMCZ evaluation board, also available from Mouser Electronics.
Together with the required EVAL-SDP-CH1Z high-speed controller board and signal source, the board demonstrates the performance of the ADAQ23875 µModule.
It includes a pre-mounted ADAQ23875, a choice of a 4.096 V or 2.048 V reference, onboard reference, low-dropout (LDO) regulator, and power supply circuits, and an 800 MHz clock distribution IC.