Micros

OLED micro displays suitable for VR/AR wearables

4th December 2017
Alice Matthews
0

In the small video displays market, microdisplays from Sony Semiconductor Solutions are a useful technology. These displays are thin, exhibit high brightness, operate at low power and are made from a solid Si-wafer substrate. With the ECX335B Organic Light-Emitting Diode Microdisplay available from FRAMOS, Sony brings a small size and high-resolution solution especially well-suited for head-mounted devices enabling Virtual and Augmented Reality at light weight and fast response speed.

The ECX335B is a small 1.8cm (0.71") diagonal active matrix colour OLED panel module based on single crystal silicon substrate and provides a Full-HD RGB resolution of 1920x1080 dots. The panel provides a small and flexible light weight display solution. The display has a wide colour gamut with a contrast ratio of 100,000:1 and a response time of microsecond order. With 24-bit colour depth, high resolution, maximum luminance is up to 500cd/m² and a serial mini-LVDS or LVDS interface units can easily be integrated into OEM devices.

Dr. Silviu Grecu from FRAMOS explains the fields of applications which benefit from the OLED Microdisplay: “With its small package, high speed and brightness, Sony Semiconductor Solutions’ ECX335B display is suitable for many potential applications using micro-sized displays in both industrial and consumer electronics. It is especially recommended as Electronic View Finder in Broadcasting and consumer cameras or for greater visual impact in 3D head-mounted devices for Augmented and Virtual Reality. The ECX335B display provides natural colour reproduction and superior moving picture quality. High-precision binoculars and monocular devices benefit in addition.”

Specific advantages for wearables and OEMs
The high contrast provided by the ECX335B OLED Microdisplay allows the additional information layer to appear seamlessly, simply added to the background for a 'real AR' experience. OLED Microdisplay, with no colour breakup, produces very high visibility of the additional layer with crisp, clear images, without blurring. The small package footprint allows wearables to be produced in a more compact form and reduced weight, for increased usability and wearing convenience.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier