Memory
Bridging the data deluge gap
Integrating solid state memory in to enterprise system architectures offers benefits in meeting demand for greater storage but comes with challenges. Can flash technology be the answer? Thomas Pavel, Director of Channel Sales at LSI, explores further in this article from ES Design magazine.
Samsung announce industry’s fastest embedded memory
Samsung has announced today that it is mass producing the world's fastest embedded memory – the industry's first eMMC 5.0 devices – in 16GB, 32GB and 64GB densities for next-generation smartphones and tablets. Featuring an interface speed of 400MB/s, the lightning-fast eMMC PRO memory provides exceptionally fast application booting and loading.
Industry’s highest density LPDDR3 mobile memory for smartphones
Samsung announce the industry's first mass production of three gigabyte low power double data rate 3 mobile DRAM, the highest density mobile memory solution for next-generation smartphones, which will bring a generation shift to the market from the 2GB packages that are widely used in current mobile devices.
Industry-first 45 nm embedded flash logic process development
Samsung has announced the industry's first 45 nanometre embedded flash logic process development. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology fulfils the stringent quality requirements of the security solution market and can be successfully deployed on a commercial scale.
Samsung announce 4Gb LPDDR3 Mobile DRAM, using 20nm-class process node
Samsung Electronics announce the industry's first production of ultra-high-speed four gigabit low power double data rate 3 mobile DRAM, which is being produced at a 20 nanometer class process node. The new 4Gb LPDDR3 mobile DRAM enables performance levels comparable to the standard DRAM utilized in personal computers, making it an attractive solution for demanding multimedia-intensive features on next-generation mobile devices such as high-perfor...
Longer-lasting EEPROMs for simpler, tougher systems
STMicroelectronics has announced the M24C32-RMN6TP and M95320-DRMN3TP/K EEPROMs. The new EEPROMs guarantee endurance of up to 4 million erase/write cycles, four times more than the 1 million cycles offered by competing devices. This gives design engineers greater freedom to update stored data more frequently and extend system lifetime, even at high temperatures.
Micron introduces 16-Nanometer Flash Memory Technology
Micron Technology is sampling next-generation, 16-nanometer process technology, enabling the industry's smallest 128-gigabit multi-level cell NAND Flash memory devices. The 16nm node is not only the leading Flash process, but it is also the most advanced processing node for any sampling semiconductor device. It solidifies Micron's leadership position in storage technology development and delivers on the company's vision to provide the most advanc...
Rochester Electronics' Product Re-Introduction through their Extension-of-Life® Program
Rochester Electronics is officially licensed by AMD to continue manufacturing the AM27C512 product family through Rochester’s’ extensive line-up of Extension-of-Life® solutions, which supports customer requirements following the end-of-life (EOL) notification.
Serving On Demand
As we demand more mobility and instant access, we need bigger, faster, and more efficient data centers to serve up the content. Can non-volatile memory successfully extend its position as the technology of choice in mobile devices, to high performance computing? Find out as we explore more in this article from ES Design magazine.
Corsair Launches Vengeance Pro Series DDR3 Memory
Corsair today announced the Corsair Vengeance Pro Series of high-performance DDR3 computer memory for PC overclockers, enthusiasts, and system builders. Available initially in capacities up to 64GB and speeds up to 2933MHz, the Vengeance Pro Series memory modules are designed to set new levels of value and overclocking performance with the 4th generation Intel Core processor family and previous generation Intel and AMD platforms.