Memory
TDK launches GBDriver RS4 high-speed SATA controller chip
TDK has developed the GBDriver RS4 series of NAND type flash memory controllers with support for 3 Gbps serial ATA. Sales will begin in January 2013. With an effective access speed of 180 MB/sec, the GBDriver RS4 is an advanced high-speed SATA controller chip.
X-Fab and Anvo collaborate to offer Non-Volatile Memory Solutions
X-FAB Silicon Foundries and Anvo-Systems Dresden today announced a cooperative agreement to offer high-speed non-volatile memory solutions that combine SRAM, DRAM and SONOS FLASH technologies; the compact design results in a small silicon footprint that keeps device costs low.
Fujitsu's Expand FRAM V Series with Extended Wide Voltage Range
Fujitsu have unveiled a new addition to its wide voltage range Ferroelectric Random Access Memory product series (V series). The newly launched MB85RC256V offers the highest density level in the V series and is Fujitsu’s first FRAM product that operates in an even wider voltage range of 2.7 V to 5.5 V, which provides even greater flexibility for customer applications.
Super Talent Expands Family of DDR3 DIMMs
Super Talent have introduced new DDR3 Mini-RDIMM, VLP RDIMM, and VLP ECC UDIMM modules designed for industrial, embedded, and sever systems. These new memory modules all feature low operating voltages and a small form factor while delivering impressive 1600MHz (PC3-12800) speeds in up to 8GB densities.
Kilopass’ Next-Generation Gusto-2 Targets Instant-On Mobile Devices
Kilopass Technology today announced Gusto-2, its second generation of code storage products, to serve the increasing numbers of new system-on-chip designs for instant-on mobile devices. The targeted SoCs perform functions, such as digital monitoring, near-field communications, and other applications serving the emerging market of Internet of things.
SK Hynix Developed Low-Voltage 4Gb Graphics DDR3
SK Hynix announced that it has developed the industry’s first 20nm class 4Gb graphics DDR3 DRAM which provides power efficiency and fast speed performance. As an eco-friendly product, it is well suited for the low power laptop since it operates at a low-voltage while it offers graphics performance as the desktop level.
Cadence Executives Offer Insight on Memory Trends Impacting Cloud Computing and Mobility
Cadence has announced that it will showcase the company’s expertise in memory design IP at MemCon 2012. Martin Lund, senior vice president of research and development, SoC Realization Group at Cadence, kicks off MemCon 2012 with his keynote speech, “How Cloud and Mobility are Disrupting the Memory Ecosystem” on Tuesday, September 18, from 9:30-10:00 AM.
Micron Announces Availability of 30nm DDR3L-RS Products
Micron have today announced high-volume availability of 30-nanometer reduced-power DDR3L-RS SDRAM for ultrathin computing devices and tablets. The 2-gigabit and 4Gb solutions reduce power consumption in standby to provide longer battery life, while maintaining the high performance and cost effectiveness of PC DRAM.
Quadruple Memory Capacity for Embedding Non-Volatile Data in SOCs
Kilopasshas today revealed details of its new embedded Vertical Cross-point Memory NVM IP bit cell. The new VCM bit cell quadruples the density of today’s anti-fuse NVM IP bit cell. The VCM bit cell will make possible program storage where today’s embedded non-volatile memory technology is cost-prohibitive or unavailable at capacities of 4Mb to 32Mb.
F-RAM Memory Module Compatible with Freescale’s Tower System
Ramtron has announced the release of its new F-RAM memory module (TWR-FRAM) that is compatible for use with Freescale Semiconductor’s popular Tower System development platform. Ramtron F-RAM core memory and integrated products are ideal for applications that require high data integrity and ultra-low power consumption — aligning perfectly with Freescale’s target markets in automotive, industrial, enabling technologies and networking.