IDT Unveils the World’s First Ultra-low-power ±50 ppm CrystalFree CMOS Oscillators
Integrated Device Technology has announced that it has released the industry’s first CMOS oscillators to feature a breakthrough ±50 ppm frequency accuracy and ultra-low power consumption. The new devices replace traditional quartz crystal-based oscillators (XOs) for up to 75% power savings in any of a broad range of applications requiring a ±50 ppm timing reference, including computing, communications, and consumer markets. IDT’s new 3LG family of CrystalFree CMOS oscillators guarantees ±50 ppm lifetime frequency accuracy.They
“The transition away from quartz-based oscillators has begun. As the world-leader in silicon timing solutions, we continue to develop high-performance, low-power solutions to meet the needs of the market,” said Fred Zust, general manager and vice president of the Communications Division at IDT. “Quartz-based oscillators have drawbacks in power, cost, availability, and reliability. IDT’s CrystalFree oscillators save up to 75% power versus their quartz-based counterparts, and also offer undeniable benefits for design simplicity, short lead times, and phenomenal reliability.”
“The semiconductor industry is moving forward at a rapid pace, but one thing that has remained unchanged for the last 50 years is the use of quartz crystal as the primary frequency source for electronics. To date, semiconductor-based frequency control products have not had the accuracy needed to challenge the incumbency of quartz in production systems,” said Sergis Mushell, principal research analyst at Gartner. “With superior pricing and performance versus crystal-based solutions, these semiconductor-based frequency sources will have a significant impact on the crystal oscillator market.”
The new devices generate stable frequencies up to 125 MHz and offer high-performance phase jitter of less than 1 picosecond over the wide frequency offset of 12 kHz to 20 MHz. In addition, semiconductor-grade shock and vibration resistance provides extreme reliability over the lifetime of the device, while the ultra-small, low-profile packages conserve valuable board area in compact designs.