Multi-protocol SiP targets IoT and wearables
The RSL10 multi-protocol system-in-package (SiP) from ON Semiconductor is now being shipped by Mouser Electronics. With ultra-low-power wireless connectivity to meet the needs of a broad range of connected applications, the versatile Bluetooth 5-certified SiP includes support for a 2Mbit per second (Mbps) RF link as well as 2.4GHz proprietary or custom protocols.
The SiP features a 48MHz Arm Cortex-M3 processor bolstered by a 32-bit dual-Harvard DSP core that supports intensive signal processing applications.
Including both flash and RAM, the device’s diverse memory architecture enables storage of the Bluetooth stack, as well as other applications.
The highly-integrated SiP includes a DMA controller, oscillators, and high-efficiency power management units, and supports a supply voltage range of 1.1 to 3.3V.
Support comes in the shape of the RSL10 SiP Evaluation Board, which provides access to all input and output connections through standard 0.1-inch headers.
Additionally, the evaluation board offers an onboard communication interface circuit and a J-Link solution to enable users to debug the board through a USB/PC connection.
ON Semiconductor’s RSL10 SiP is designed to bring ultra-low-power connectivity to Internet of Things (IoT) devices, high-performance wearables, fitness trackers, smart locks, and appliances.
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