Design

High performance solution meets embedded applications

14th March 2018
Lanna Deamer
0

Synopsys has announced the availability of the complete Universal Flash Storage (UFS) IP solution, compliant with the latest JEDEC UFS v3.0 standard. The high-throughput, low latency DesignWare UFS 3.0 IP solution doubles the bandwidth to 11.6Gbps per lane for a faster interface between SoCs and storage ICs, compared to UFS 2.1. The power efficient MIPI M-PHY delivers less than 3.5mW/Gbps per lane by supporting a range of burst modes and power management modes with fast recovery time.

In addition, the UFS 3.0 host controller's inline encryption and decryption engine allows secure data exchange to the storage device. Designers can accelerate software development and conduct interoperability testing prior to silicon with the DesignWare IP Prototyping Kit.

By providing a complete UFS 3.0 IP solution, Synopsys enables designers to efficiently integrate the necessary functionality into applications requiring embedded and removable storage.

"Implementing the latest UFS 3.0 interface with MIPI M-PHY v4.1 for the physical layer and the new UniPro v1.8 for the link layer enables designers to achieve the best performance and power efficiency for their flash storage SoCs," said Joel Huloux, Chairman of the MIPI Alliance board of directors.

"As an active member of MIPI working groups and the board of directors, Synopsys has been a strong partner in driving the adoption of MIPI standards to enable a wide variety of mobile and mobile-influenced applications."

"Consumers expect fast access to gigabytes of secure data without significantly impacting their device battery power," said John Koeter, Vice President of Marketing for IP at Synopsys.

"By providing a complete and compliant DesignWare UFS 3.0 IP solution for flash storage, Synopsys enables designers to meet the power, performance, and security requirements of their advanced SoCs with significantly less risk."

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier