Design
DELO develop line lamp for curing adhesives
DELO has developed a line lamp for curing adhesives and other multi-functional polymers.The lamp offers high curing speeds and great flexibility for integration into production lines, like those found in consumer electronics assembly, the company claim. It can also be used, for example, in the lamination of thin-film solar cells.
Digital options for product configuration
Device manufacturers face a large range of options when creating the interface between their product and a signal source, a remote point of testing or tooling point.
New version of Flex Power Designer Software released
Flex Power Modules has released version 4.5 of their popular ‘Flex Power Designer’ (FPD) Tool which enables detailed simulation, configuration and optimisation of power systems using the company’s DC/DC converter products.
UMC and Cadence collaborate on 3D-IC hybrid bonding reference flow
United Microelectronics Corporation (UMC) and Cadence have announced that the Cadence 3D-IC reference flow has been certified for UMC’s chip stacking technologies, enabling faster time to market.
Long-term support for parallel PCI bus to remain assured
At Embedded World 2023, EKF Elektronik will be launching two new 3U CompactPCI processor boards with 11th generation Intel Core and Xeon processors (codename Tiger Lake H45).
Line lamp from DELO offers high intensity and flexibility in adhesive curing
DELO, global specialist manufacturer of industrial adhesives for automotive, consumer electronics and semiconductor industries, has developed a line lamp for curing adhesives and other multi-functional polymers.
Double-pulse testing to determine energy loss on wide bandgap mosfets
The power-density advantages of smaller and lighter designs are particularly evident in space-constrained and/or mobile usages such as electric vehicles, but compact power electronics are more broadly desirable as well.
How nature is inspiring the latest underwater technology collaborations
NavyX and Dstl are working together to fund research towards new methods of underwater propulsion and design, with heavy inspiration from what is currently living in the depths.
Solid Sands partners with Rapita Systems
Solid Sands and Rapita Systems have announced a new strategic partnership which aims to improve code coverage analysis on parts of the C++ standard library code that are typically invisible to coverage analysis tools.
SEMICON 2023: sustainability, smart manufacturing, advanced chip tech and talent
With Korea among the top destinations for semiconductor manufacturing equipment spending, the stage is set for SEMICON Korea 2023 as the region’s premier microelectronics event opens (1st February) at COEX in Seoul for insights into the latest developments and trends in areas critical to industry growth.