Design tools certified for 3D chip stacking technology
TSMC has certified Cadence Design System’s design solutions for the new TSMC System-on-Integrated-Chips (TSMC-SoIC) 3D advanced chip stacking technology, which integrates heterogenous chips—including logic ICs and memory—that are fabricated on different process nodes onto a single chip stack for a subsequent packaging process.
IoT development board ensures secure designs
Availability of a development board that makes it easy for engineers to create secure cloud-connected designs has been announced by RS Components. The PIC-IoT WG development board (AC164164) from Microchip offers a simple way to develop PIC microcontroller-based applications and connect them to the Google Cloud IoT Core platform.
Ruggedised appliances secure operational technology
Industrial Control System (ICS) security has become more challenging than ever as information technology (IT)/operational technology (OT) convergence has emerged as the new standard for industrial cyber security, adding new levels of challenges.
Card printers recognised with 2019 iF DESIGN AWARD
Innovator at the edge of the enterprise with solutions and partners that enable businesses to gain a performance edge, Zebra Technologies, has announced the ZC100 and ZC300 series card printers have received the prestigious iF DESIGN AWARD in the discipline of product design.
Software platform integrates with chip design kit
The PathWave Advanced Design System (ADS) and PathWave RFIC Design from Keysight Technologies are now integrated with the latest interoperable process design kit (iPDK) from Samsung for the 28FDS (28nm fully-depleted silicon-on-insulator) process technology.
Memory IP subsystem wins ISO 26262 ASIL C certification
Good news for Cadence Design Systems is that its LPDDR4/4X memory IP subsystem, utilising TSMC’s 16nm FinFET Compact (16FFC) technology, has achieved ISO 26262 ASIL C certification from SGS-TÜV Saar. The certification confirms that the Cadence IP is complete and ready for use by customers creating advanced systems-on-chip (SoCs) for advanced driver assistance systems (ADAS) and L3/L4 autonomous driving applications.
Helping Collins Aerospace future-proof avionics systems
Future airspace will be filled with drones, commercial aircraft, helicopters, and more. Several prototypes are currently targeting urban air mobility solutions such as air taxis, or revolutionary aircraft models, such as next-generation commercial supersonic aircraft. Add to this autonomous swarm technologies, such as manned-unmanned teaming, and systems for future vertical lift and it’s clear that the technology wave coming to any aerospac...
Next generation additive manufacturing process for ceramics
A new £900,000+ research project, led by KW Special Projects (KWSP) and funded by the UK’s innovation agency Innovate UK, is set to rethink the additive manufacture of ceramics. Called CerAMake, the project aims to exploit existing deposition technologies to provide improved properties via a scalable ceramic binder jetting platform.
Wind River helps Collins Aerospace future-proof avionics systems
Future airspace will be filled with drones, commercial aircraft, helicopters, and more. Several prototypes are currently targeting urban air mobility solutions such as air taxis, or revolutionary aircraft models, such as next-gen commercial supersonic aircraft. Add to this autonomous swarm technologies, such as manned-unmanned teaming, and systems for future vertical lift and it’s clear that the technology wave coming to any aerospace manuf...
Power efficiency for SoCs in data-intensive applications
The newest portfolio solution of 112G Long Reach (LR) SerDes PHY on a leading-edge 7nm process node for next-generation terabit switches, routers, optical transport networks (OTNs), and high-performance networking equipment, has been announced by Rambus.