Component Management

Compound exhibits a thermal conductivity of 2.6W/m°K

18th March 2015
Nat Bowers

Fujipoly has announced an easy-to-apply, thermally conductive and electrically non-conductive silicone-based compound which exhibits a low thermal resistance. Sarcon SG-26SL delivers a thermal conductivity of 2.6W/m°K when dispensed between a component such as a CPU or power converter and a heat sink.

The product’s physical characteristics and minimal bleed and evaporation properties make Sarcon SG-26SL a great choice for thin bond line applications. If any board re-work is required, the material can be removed by simply wiping with a cloth.

The thermal interface material delivers consistent performance across broad temperatures ranging from -55 to +205°C. Packaging options include pre-filled syringes and bulk jars for manual or automated dispensing applications.

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