Component Management

Infineon Technologies has achieved a major breakthrough in the manufacturing of power semiconductors on 300-millimeter thin wafers. In February, the company received the first customer go-aheads for products of the CoolMOS family produced by the 300-millimeter line at the Villach (Austria) site. The production process based on the new technology has completed qualification from start to finish and customers have given the go-ahead.

The new CircuitMedic Micro Drill system from Intertronics is versatile and powerful – making it ideal for milling, drilling, grinding, cutting and sanding circuit boards. It removes coating, cuts circuits, cuts leads, drills holes, cuts slots, shapes FR4 and performs many other procedures using various interchangeable bits.

Europlacer debuts Project iico, a concept that combines outdated systems with new, innovative parts to result in an environmentally smart, technologically advanced assembly system. In the 1990s and early 2000s, Europlacer manufactured then-progressive placement systems, EP600 and Progress6.

SEHO Systems now offers a new technology for virtually void-free soldering results with the MaxiReflow HP. Whether for power electronics, electronic aviation systems, medical equipment or electronic systems for the automotive industry, voids in solder joints represent one of the main problems.

Manncorp introduces the MC-LEDV3, a new high-speed pick and place machine built to assemble LED tube lights, flexible LED strips and LED bulb boards. The MC-LEDV3 features three pick-and-place heads mounted on a high-precision, ball-screw-driven gantry. Simultaneous pickup, on-the-fly (vision based) component alignment, and feeder placement optimization combine to achieve placement rates of up to 10,000 LEDs per hour, per IPC-9850.

As technologies develop in industries such as electronics, energy, packaging, medical devices, cosmetics and pharmaceuticals and automotive, Intertronics have understood the need for ever more precise, reliable dispensing of micro quantities of adhesives and similar materials.

American Semiconductor announces TowerJazz is the first foundry with a CMOS process, CS18, available for physically flexible wafers and ICs utilizing FleX Silicon-on-Polymer. This announcement was made at the 12th annual Flexible & Printed Electronics Conference presented by the FlexTech Alliance held in Phoenix, Arizona on January 29 - February 1, 2013.

Juki Automation Systems has announced that Inovar recently purchased three KE-1080EN High-Speed Flexible Mounters. “Inovar has enjoyed an excellent partnership with Juki for many years. In this partnership, Inovar has found that the Juki pick-and-place equipment is tuned very well to the mix of business that we do. The purchase of our new Juki machines helps us to continually drive to exceed our customer expectations of quality and on-time ...

Rehm Thermal Systems announces its next-generation advanced packaging and semiconductor solutions with no atmosphere – the Vacuum Soldering process. Rehm offers three VS Series Vacuum Soldering system models. They’re all small, all powerful, and all low cost. The VS320, the VS160UG, and the VS160S benchtop each feature fast heating and cooling rates with easy profile setup and editing plus data logging.

These days, we can find microcapsules in almost every industrial sector, where they take numerous roles. However, dispensing these fragile materials can be a problem since clearly it is important that the microcapsules be undamaged by the dispensing process. In adhesive technology, microcapsules can fulfil several functions. For example, microcapsules may be an integral part of the control of reaction and curing processes. Some anaerobic “t...