Manncorp’s Split-vision Rework Station Has Auto Removal/Placement Head, For Bgas And Qfps
BGAs, QFPs and other fine-pitch devices can now be desoldered, removed and replaced with the BR720 lead-free rework station from Manncorp. Utilizing split-vision zoom optics with 22x magnification, real-time images of components superimposed on solder pads are continuously displayed on the system monitor. Perfect alignment is achieved when operator makes final X and Y micrometer adjustments with LED lighting providing high image contrast.
Manncorp Adds LED Board Assembly Equipment Section To Website
Answering growing demand for equipment dedicated to LED assembly, manncorp.com now includes LED-capable pick-and-place systems -- one of which can also serve as a mid-range placer for today’s surface mount components.
Essemtec’s PANTERA-XV Is Ideal for SMEs
Essemtec announces that its PANTERA-XV SMD Placement Machine features an ideal price/performance ratio for SMEs (Small and Medium Enterprises). The PANTERA-XV is designed for prototype and mid-size series manufacturing. The machine offers ideal combinations of speed, accuracy and wide application range.
Rochester Electronics Expands its Space-Level Manufacturing Services
Rochester Electronics has expanded its space-level continuing manufacturing services and product offering to provide a continuous, long-term source of certified semiconductor devices. Since many manufacturers are discontinuing production of space-level parts due to the rigorous certification processes and expansive infrastructure required to manufacture, test, and store these low-volume parts, customers are often left with few places to turn for ...
SABIC Launches Sustainable Valox* ENH Resins for E/E Applications
SABIC Innovative Plastics today launched three new sustainable additions to its Valox* ENH resin series that delivers advanced flame retardance (FR) together with outstanding mechanical and electrical performance to the electrical and electronics (E/E) industry. These innovative materials help customers comply with global environmental regulations, including the European Union (EU) Waste Electrical and Electronic Equipment (WEEE) directive that i...
Epoxy Manufacturer Releases a Strong Fiber Reinforced Epoxy Resin
Comprised of an aramid fiber reinforced epoxy adhesive for high performance structural bonding, Master Bond's EP30R features outstanding dimensional stability and enhanced impact resistance. This two part epoxy is formulated to cure at room temperature or more rapidly at elevated temperatures.
Contact Cleaning System From Teknek
Teknek has launched Nanocleen, said to be a new generation of contact cleaning technology with advanced contamination and static control features. At the core of the Nanocleen system is a specially formulated roller and adhesive roll.
Moisture resistant gasketing resin from Intertronics
Intertronics has introduced a tack-free, soft gasket material from sales partner, DYMAX, for sealing fuel cells, appliance housings, and critical electronic assemblies and devices. Light Weld GA-140 is a UV/Visible light-curable form-in-place (FIP) and cure-in-place (CIP) gasket developed for applications requiring low compression set, tack-free surface, and durable, reliable sealing.