Component Management
One-part adhesive forms flexible, conductive bond
Intertronics has released Polytec PU 1000, a single part adhesive which cures quickly at room temperature to a flexible, electrically conductive polymer. It can replace traditional epoxies which are rigid and require thermal processing, offering production efficiencies and enabling applications where pliability and conductivity is important.
Machine forms strong LFT from glass fibres & polypropylene resin
Mitsubishi Heavy Industries Plastic Technology has announced the D-LFT System, a kneading/injection moulding machine capable of forming high-strength Long-fibre-Reinforced Thermoplastic (LFT) products from glass fibres and PolyPropylene (PP) resin, all in one process. A screw shape and glass fibre feed method eliminate the need for kneaded pellets (compound), enabling manufacturing cost reductions.
Solder paste is first to boast temperature stability
The electronics division of Henkel has just announced the launch of temperature stable solder paste material, Loctite GC10, now available from Ellsworth Adhesives Europe. As the first material of its kind to boast temperature stability, the launch of Loctite GC10 marks a significant breakthrough in the solder paste market.
Research uncovers surface current behaviour of Si(111)-(√7 x √3)-In
Researchers at the International Center for Materials Nanoarchitectonics, Tsukuba have uncovered the underlying structures and the behaviour of currents on the surface of Si(111) which provide clues to its superconductivity. Superconductors have effectively zero resistance and act as perpetual carriers of electric current with no need for a connected power source, giving rise to many applications in electronics.
Automotive & batteries to drive graphite market to $17.56Bn by 2020
According to a new market report published by Persistence Market Research ‘Global Market Study on Graphite: Battery Segment To Witness Highest Growth by 2020’, the global graphite market was valued at $13.62Bn in 2013 and is expected to grow at a CAGR of 3.7% from 2014 to 2020, to reach $17.56Bn in 2020.
Polyurethane resin system features a Tg of 200°C & higher
A polyurethane resin system, which cures quickly and allows the production of high heat stable modelling, tooling and rapid prototyping boards, has been introduced by Huntsman. The VITROX EST system is suitable for the aerospace, automotive, marine and shipbuilding sectors.
Laminate & prepreg material reduces weave-induced skew
Isola Group has announced the introduction of Chronon, the company’s latest ultra-low loss, high-speed laminate and prepreg materials engineered to mitigate skew issues in high-speed designs that have differential pairs. The introduction of Chronon, which follows the 2014 launch of Gigasync, expands the company’s portfolio of PCB materials to mitigate skew in high-speed designs.
Sidewall pattern enhances custom thin film substrate
Adding a sidewall patterning capability to its custom thin film substrate offering, Vishay Intertechnology can now provide conductive patterning on up to four surfaces with compact line width and gap dimensions, increasing design flexibility and density for miniaturisation in military, aerospace, medical and telecomms equipment.
Adhesive targets stringing & shingling solar modules
Engineered Material Systems has introduced the DB-1541-S9 conductive adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to cell and ribbon metallisation during damp heat exposure.
SOI technology is gaining momentum
The SOI Industry Consortium announces silicon-on-insulator (SOI) technologies gaining strong industry momentum towards a rapidly growing SOI ecosystem. A robust foundry offer and leading fabless players are demonstrating how simple it is to design and manufacture ICs on Fully Depleted SOI (FD-SOI) and RF-SOI technologies, confirming SOI as a very competitive technology platform for fast-growing semiconductor applications.