Electronics adhesives that cure with UV
The UK adhesives supplier, Techsil, has launched a range of new adhesive products with low ion content which cure with UV, visible light or moisture. Developed by manufacturers Panacol, these products were specially formulated for applications in the electronics and consumer electronics industry, where heat sensitive parts need to be assembled.
Custom thin films for wafer coatings
Upon customer request, LASER COMPONENTS can coat substrates with diameters of up to 390mm, including, for example, wafers that are required in microchip manufacturing and other industries. The blanks may consist of silicon, fused silica, N-BK7, or other glasses.
Cleaning agents ensure optimal copper deoxidation
The cleaning agents of the VIGON PE Series for Power Electronics have been successfully established in the market and are reportedly qualified by leading power module manufacturers. Each cleaning agent provides good cleaning performance and reliably removes flux residues from power modules/DCBs after die attach or heat sink soldering.
Distribution agreement expands reach in global coatings market
Producer of speciality graphene materials, Applied Graphene Materials (AGM), has signed a distribution agreement with Carst & Walker (C&W) that will extend the Company’s commercial reach into the South African chemical markets. C&W are part of Hobart Enterprises, who operate across multiple global markets.
How to future proof your UV curing needs
Intertronics is now offering new products in the Dymax MX-Series of high intensity LED UV curing lamps. The products offer manufacturers the flexibility to tailor their LED UV curing systems to their needs, by offering three different emitter patterns, as well as three different wavelengths - 365, 385 and 405nm.
Heat-resistant silicone pottants for advanced power modules
A global specialist in silicones and silicon-based technology, Dow, has further expanded its portfolio of protective pottants with the launch of new, heat-resistant dielectric gels under the DOWSIL label: EG-4000, EG-4100 and EG-4120. The latest additions are thermally stable silicone pottants for protective encapsulation of sensitive components within SiC and GaN power modules, on PCBs and in industrial sensors and actuators.
One component epoxy features thermal cycling resistance
The Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature.
Light fixation for two-component epoxy resins
A light fixation for two-component epoxy resins has been introduced by DELO. Thanks to this hybrid chemistry, users benefit from faster, less complex production processes and simplified logistics. DELO-DUOPOX DB8989 provides high speed for a two-component epoxy resin, securing the components against slipping in just a couple of seconds.
Efficient RAIN RFID label manufacturing
A new development in the effort to achieve high-volume inlay manufacturing has been announced by DELO Industrial Adhesives, Mühlbauer and Impinj. The three RAIN RFID companies have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.
Primerless silicone encapsulant now available
It has been announced that Ellsworth Adhesives are now taking orders for the newly-launched Dowsil (Dow) EI-2888 Primerless Silicone Encapsulant. Dowsil EI-2888 is an optically clear encapsulant designed for professional LED lighting applications. The 100% silicone encapsulant provides LEDs with essential protection from moisture and surface contaminants.