Communications

phyFLEX i.MX 6 SOM Supports i.MX 6 Series Applications Processors From Freescale

18th February 2013
ES Admin
0
PHYTEC launches the phyFLEX i.MX 6 System on Module, a feature packed SOM supporting the i.MX 6 series of application processors from Freescale. The i.MX 6 series is a highly scalable family of embedded processors based on the ARM Cortex-A9 core architecture with single, dual, and quad-core offerings. The single and dual-core variants provide cost-effective performance, while the quad-core device provides the performance required for the highly demanding applications.
The flagship i.MX 6Quad device, with an exceptional 3D graphics engine, stereoscopic image sensor support for 3D imaging, HD video engine delivering 1080p60 decode and 1080p30 encode, 3D video playback, and separate 2D engine for UI. Other features include: 64-bit DDR3, SD3.0, USB 2.0, Gigabit Ethernet, integrated FlexCAN and MLB busses, PCIe, SATA-II, dual MIPI display port, dual MIPI camera port, and dual HDMI v1.4.



The combination of industrial temperature rating, 3.3V I/O, and highly reliable interconnects of the phyFLEX i.MX 6 make it possible for developers to create products that can endure rugged and extreme thermal industrial environments.



PHYTEC production-ready SOM technology, combined with operating system Board Support Packages, provides a critical foundation so embedded designers do not have to develop their application from the ground up. Designing in a SOM reduces the complexity and scope of product developments, allowing OEMs to significantly reduce cost, time-to-market and design risk. The phyFLEX i.MX 6 provides a perfect balance of power efficiency and high performance and is well suited for deployment in industries requiring high-end, feature-intensive applications.



Features and specifications for the phyFLEX i.MX 6 SOM include:



i.MX 6 applications processor support:

-i.MX 6Solo, 6Dual, or 6Quad products based on ARM Cortex-A9 technology and running at speeds up to 1.2 GHz each

-Hardware Accelerators: VPU, IPUv3H, GPU2Dv2, OpenVG 1.2, ASRC



Memory:

-Up to 4 GB DDR3 SDRAM

-Up to 16 GB NAND

-Up to 16 MB SPI-NOR

-32 KB EEPROM

-Flash Expansion - 2x SDIO/MMC



Networking:

10/100/1000 Mbit/s Ethernet



Other I/O:

-USB 2.0 OTG and Host

-PCIe

-SPI, CAN, UARTs, I²C, PWM, CSPI, I²S/SSI/AC97, EIM, MLB

-SATA-II



Display:

-2x LVDS

-1x HDMI

-2x Parallel (optional)

-Touch control



Power:

5V supply, 3.3V I/O



Operating Temperature:

-40°C to +85°C



Dimensions:

60 x 70 mm



Operating System Support:

Linux and Windows



The phyFLEX i.MX 6 is available in a PHYTEC Development Kit. The kit includes the SOM, carrier board, Board Support Package, demo images and all contents required for immediate start-up. The carrier board serves as a starting point for design of target hardware. The kit provides an immediate platform on which to develop application code that can be seamlessly integrated along with the SOM into prototype, pre-production, and production systems. OEMs with aggressive timelines or limited resources can employ PHYTEC's full range of design services that include: embedded hardware design; Linux, Windows Embedded and Android adaptation; and complete turnkey designs.



“The phyFLEX i.MX 6 is an exciting addition to PHYTEC’s product line of System on Modules based on Freescale devices, said Michael Mitezki, Chief Executive Officer of PHYTEC, “Our deployment-ready hardware, in combination with production-ready Windows Embedded Compact 7 and Linux BSPs, enable embedded developers to reach their product goals with minimal development time.



Our i.MX 6 series processors enables outstanding integration, performance, and scalability, as evident in the strong feature set on PHYTECs advanced i.MX 6 based SOM,” said Rajeev Kumar, portfolio manager for the i.MX Product Line at Freescale, “We are excited about the collaboration with PHYTEC, enabling designers to meet the demands for more innovation, new features, shorter product life-cycles, plus deliver stunning user experiences.”

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier