LIN controller ICs reduce BOM costs & save space
Expanding its extensive array of ICs and board level products designed for use in LIN implementations, Melexis has introduced the MLX81107 and MLX81109. Combining high degrees of built-in functionality and low unit costs, these freely-programmable, monolithic devices are able to address growing demands within the automobile industry for sophisticated LIN-based switches, actuators, drivers, sensor interfaces and LED lighting systems.
The MLX81107 and MLX81109 both incorporate a physical layer LIN transceiver, LIN controller, voltage regulator, 16-bit RISC-based MCU, 32kB of Flash memory and 20-channel ADC, as well as possessing 16-bit PWM capabilities. The LIN protocol handler is compliant with LIN 2.0, LIN 2.1 and LIN 2.2, as well as SAE J2602. The ICs have four high voltage capable (12V direct) I/Os and eight low voltage capable (5V) I/Os. Through these interfaces, communication with the vehicle’s LIN infrastructure is facilitated. Every I/O can be programmed to control the application components using the built-in Flash memory resource.
The devices' high level of integration dramatically reduces the BOM costs and saves board space. The combination of the LIN controller and approved LIN driver together with directly controlled high/low voltage capable I/Os means that LIN can be rapidly implemented into a wide variety of different applications.
As these ICs are supplied in 5x5mm QFN packages, thermal performance is maximised and board real estate is conserved. To ensure their reliability in challenging automotive environments, an operational temperature range from -40 to +125°C is supported, with over-temperature shutdown and load dump (40V) protection mechanisms included.
Michael Bender, LIN Product Line Manager, Melexis, commented: “The MLX81107/9 offering brings a whole new dimension to in-vehicle network infrastructure, enabling a new generation of smart LIN applications to be realised. Engineers can benefit from the mix of highly advanced technology, design flexibility and cost effectiveness all fitted inside a single chip solution. The result is a streamlined, commercial-attractive semiconductor platform that facilitates the development of considerably smaller LIN modules with lower price tags.”