Highly integrated audio SoCs with active noise cancellation

The highly integrated single chip solution combines Bluetooth Dual Mode with BES’ advanced Active Noise Cancellation technology, creating a premium low-power platform for wireless audio applications.

BES’ new wireless audio solution will be showcased at the Consumer Electronics Show (CES) in Las Vegas from January 8th to 11th, 2019, in both CEVA’s meeting suite at the Westgate Hotel and BES’ meeting suite in the Venetian Hotel.

Figo Gao, VP of Business Development at BES, stated: “Customers really value high quality audio and in the premium market Bluetooth-enabled headsets are surpassing traditional wired headsets. Our expertise in audio platforms coupled with CEVA’s advanced RivieraWaves Bluetooth Dual Mode IP allows us to create exciting solutions for this rapidly growing market.”

Aviv Malinovitch, Vice President and General Manager of the Connectivity Business Unit at CEVA, added: “We are delighted to announce BES as a licensee for our Bluetooth IP. Wireless audio has always been a traditional strength of Bluetooth and the latest RivieraWaves BTDM5 IP brings all the latest Bluetooth 5 innovations to our customers.”

CEVA’s RivieraWaves Bluetooth IP platforms provide comprehensive solutions for both Bluetooth LE and Bluetooth dual mode connectivity. Each platform consists of a hardware baseband controller, plus a feature-rich software protocol stack. A flexible radio interface allows the platforms to be deployed with either RivieraWaves RF or various partners’ RF IP, enabling optimal selection of foundry and process node.

All Bluetooth 5 features are supported, including LE 2Mbps data rate, Long Range and LE Advertising Extension. Widely adopted with different processor subsystems, CEVA also offers RISC-V based fully integrated platforms. With more than 1.5 billion devices shipped to date and dozens of licensees, the RivieraWaves Bluetooth IP is widely deployed in consumer and IoT devices with many of the world’s leading semiconductors companies and OEMs, including smartphones, tablets, wireless speakers, wireless headsets and earbuds, hearing aids and other wearables.