Reliable connectivity for CPUs in server platforms

29th June 2016
Nat Bowers

TE Connectivity has announced its LGA 3647 Socket for Intel’s processors specified under their new server platforms. The socket meets next-gen design requirements of these latest CPU processors for higher performance and better system scaling. As one of only two validated suppliers of this technology, TE is a key source of this vital socket for new platforms used in data centres and High Performance Computing (HPC).

TE’s LGA sockets provide a compressive electrical interconnect between the processor and the PCB. As computing power increases, processor chips’ pin counts are increasing. The LGA 3647 socket is the first LGA socket to feature a two-piece design for the larger processor that improves issues with warpage and offers better coplanarity and reliability in connectivity. TE’s flexible tooling also provides fast turnaround on prototypes so engineers can have sockets in hand at the earliest stages of the design process.

Jaren May, Manager of Product Management, Data and Devices unit, TE Connectivity, commented: “Designers using the latest CPU processors for new server platforms and HPC applications needs CPU sockets that deliver performance and reliable connectivity. Our LGA 3647 socket enables new system designs that deliver leading-edge performance through a robust design that addresses the demands of these next-gen processors.”

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