High-speed interconnects enhance signal integrity

8th September 2020
Mick Elliott

The AcceleRate HD range of ultra-dense micro interconnects from Samtec is in stock at distributor RS Components.

These space-saving, high-performance mezzanine strips feature high-speed Edge Rate contacts and open-pin-field design for greater flexibility and ease of integration.

They are ideal for applications demanding fast, clean signalling, from broadcast video through to optical systems.

Samtec’s AcceleRate HD comes in a highly dense design with up to 240 I/Os (4 rows with 10-60 positions each). Only 5 mm high and 5 mm wide, it is a low-profile, ultra-slim solution that saves space and is easy to integrate into existing ICs.

Its solder ball technology enables simplified processing and self-aligning, reducing installation time.

There are also various stack height (7 - 16 mm) and mount options available (right-angle and cable in development) to suit a variety of application requirements.

Another key advantage of using AcceleRate is its flexibility. It comes in an open pin-field design enabling more grounding and routing options.

In addition, its ADM6 surface mount header, delivering 56 Gbps PAM4 performance, is compatible with both the UMPT and UMPS series, allowing flexible, two-piece power/signal solutions.

Other key features include the high-speed Edge Rate contact system that is designed, simulated and optimised for 50 Ω and 100 Ω systems to enhance signal integrity performance. The milled surface of the contact creates a smooth mating surface, which reduces wear on the contact increasing durability.

The AcceleRate range is compatible with PCIe Gen 5 and supports 56 Gbps PAM4 (28 Gbps NRZ) applications. It is currently available in two series: ADM6 0.635 mm 4-Row Terminal and ADF6 4-Row Socket.

The Samtec AcceleRate range is now available from RS in the EMEA region.

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