Conduction cooled chassis offered in small form factor designs

5th May 2016
Jordan Mulcare

Pixus Technologies has announced conduction cooled chassis in the ATR format or in specialty Small Form Factor (SFF) designs. Enclosures formats are available for both OpenVPX and MicroTCA architectures. The Pixus conduction-cooled ATRs come in standard 1/2 and 3/4 sizes for 3U or 6U boards.

There are also options for the MicroTCA.3 Hardened form factor as well as heat exchanged versions. The enclosures are designed to meet MIL-STD-704, MIL-STD-810G, and MIL-STD-461. Off-the-shelf power interface boards are available to easily incorporate VITA 62 or PICMG 2.9 power supplies.

Pixus provides rugged and 19” rackmount enclosures in multiple backplane architectures including OpenVPX, MicroTCA, AdvancedTCA, and legacy CompactPCI/VME. The company also provides specialty backplanes and handle/panel sets for embedded boards.

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