COM express module with AMD Ryzen embedded V1000/R1000 SoC
IBASE Technology has announced the launch of the ET977 low-power COM Express Compact Type 6 modules, which are based on the AMD Ryzen Embedded SoC to enable next-generation embedded designs. The series targets a wide range of applications including AIoT, retail, medical, transportation, automation and gaming fields.
Jetson system-on-module powers embedded box PC
Available now from RDS is the new AAEON BOXER-8251AI powered by the Jetson Xavier NX from NVIDIA.
ATR chassis for VITA 48.4 liquid flow-through cooling
Elma Electronic has released a new rugged ATR chassis compliant with VITA 48.4 for liquid flow-through (LFT) cooling. The new backplane in the chassis is designed for data rates up to 10 Gbps and can handle 300W per slot. This enables the system to accommodate the intense thermal management needed in high density embedded computing systems.
SparkFun Artemis module adds camera kit
The Artemis Development Kit with Camera from SparkFun is in stock at distributor Mouser Electronics, Inc.
Raspberry Pi Compute Module 4 in stock at Farnell
The new Compute Module 4 (CM4) from Raspberry Pi is now available at Farnell. The distributor has made a heavy investment in stock to meet volume orders.
Farnell micro:bit manufacturing hits 5 million
Farnell is celebrating the manufacture of 5 million BBC micro:bit devices since its launch in 2016.
congatec Computer-on-Modules with Intel Core processors
congatec has announced the launch of 12 brand new Computer-on-Modules in parallel with the Intel IOTG (Internet of Things Group) launch of the 11th Gen Intel Core processors. Based on the new low-power high-density Tiger Lake SoCs the new modules offer greater CPU performance and higher GPU performance along with PCIe Gen4 and USB4 support.
High-end FPGA SOM based on Arria 10 FPGA GX
iWave Systems has announced a new System on module based on the powerful Intel Arria 10 FPGA GX devices. The Arria 10 FPGA SOM is power-packed with up to 1150K Logic Elements, duel DDR4 RAM with 64 bit and 32-bit storage capabilities. High speed I/Os and interfaces enable the module to fulfil complex data integrity requirements while ensuring faster throughput, reduced latency, and low power execution, accelerating the development of FPGA-based a...
OpenVPX backplanes in VITA 65 and VITA 66.4 formats
Pixus Technologies has announced new 3U OpenVPX backplane designs in multiple configurations. Pixus has developed OpenVPX backplanes utilising the BKP3-CEN07-15.2.3 VITA 65 profile. The seven-slot backplane is standardly designed to PCIe Gen3 speeds with options for higher levels.
Richardson RFPD stocks SiC development kits
In-stock availability and full design support capabilities for a new family of development kits from Microchip Technology is announced by distributor Richardson RFPD.