Products
Agilent Technologies to Showcase LTE Test Solutions at LTE World Summit 2010
Agilent Technologies announced it will demonstrate the latest LTE test application solutions at the LTE World Summit 2010, May 17 - 19, in Amsterdam, at the Hotel Okura, Booth 30.
Agilent Technologies Extends LTE Leadership with New Signal Studio for 3GPP LTE and VSA Software Capabilities
Agilent Technologies announced the availability of key enhancements to its Signal Studio for 3GPP LTE and 89600 Vector Signal Analysis (VSA) software. The Signal Studio software runs on Agilent's signal generators and emulators. The VSA software runs on Agilent's analysis platforms.
Agilent Technologies Enhances Vector Signal Analysis Software
Agilent today announced the availability of key enhancements to its 89600 Vector Signal Analysis (VSA) software which is used by cellular communications and wireless networking R&D engineers around the world.
OSRAM Opto Semiconductors launches video training series for LED, Solid State Lighting standardization and regulations
OSRAM Opto Semiconductors has launched a new web initiative dedicated to providing information and resources for LED, solid state lighting standardization and regulation on its’ new LED Light Site, ledlight.osram-os.com.
OSRAM Opto Semiconductors launches video training series for LED, Solid State Lighting standardization and regulations
OSRAM Opto Semiconductors has launched a new web initiative dedicated to providing information and resources for LED, solid state lighting standardization and regulation on its’ new LED Light Site, ledlight.osram-os.com.
Vishay Electro-Films to Showcase High-Performance Wire Bondable Passive Components at IEEE MTT 2010 International Microwave Symposium
Vishay Intertechnology announced that it will be showcasing Vishay Electro-Films (EFI) high-performance wire bondable thin film resistors, MOS and MNOS capacitors, and spiral inductors at the IEEE MTT 2010 International Microwave Symposium, taking place May 23-28 in Anaheim, Calif. Each product category will have its own area at booth 2513, where Vishay’s engineering and sales staff will provide demonstrations of the company’s passive compone...
Fairchild Semiconductor’s MicroFET MOSFET Shrinks Its Footprint for Portable Designs
Portable designers continue to look for solutions that offer higher efficiency in smaller and thinner form factors. To meet this need, Fairchild Semiconductor offers a portfolio of high performance MicroFET MOSFETs packaged in an ultra-compact and thin footprint (1.6mm x 1.6mm x 0.55mm).
NXP Powers Efficient Lighting Introducing Dimmable SSL2103 LED Controller IC
NXP Semiconductors announced the introduction of a new LED controller, the SSL2103. Extending NXP’s successful product family of AC/DC LED drivers (SSL2101/SSL2102) for a wide range of lighting applications such as retrofit lamps, the SSL2103 includes the functionality and performance of its sister product, the SSL2101, while extending the application reach towards higher power solutions. The SSL2103 is a versatile device for all AC/DC LED ligh...
STMicroelectronics Unveils Breakthrough Power Package Extending Power-Density Advantage of MDmesh V MOSFETs
STMicroelectronics has increased the power density achievable with its latest generation MDmesh V power MOSFET technology by introducing an advanced high-performance power package.
STMicroelectronics Delivers All-Round Efficiency Gains with Smallest Four-Line ESD Protection IC Supporting All Leading High-Speed Interconnects
STMicroelectronics has unveiled an IC for use with today’s highest-speed multimedia and storage interconnects, including HDMI, DisplayPort, USB 3.0, Serial ATA (SATA) and DVI. The new device provides ESD protection for four data lines within a 1x2mm-outline package, saving at least 30% of PCB space compared to other devices.