1-2301920-1

Headers & Wire Housings 5POS,PICO MQS,REC HSG,UNSLD

Automotive-Grade Mini Signal Connector System

TE Connectivity's PicoMQS is a 1.27 mm miniaturized, robust, and reliable connector system designed for space-constrained signal interfaces in automotive applications.

Benefits:

• Automotive-Grade Robustness: Class 2 vibration stability, with a maximum temperature of +130°C (Sn) or +150°C (Ag). It supports 0.22 mm² wire and continuous current capability up to 4 A at +80°C.
• Space and Weight Reduction: Achieves up to a 78% reduction in packaging weight compared to traditional MQS systems, a 30% reduction in pin pitch to 1.27 mm, and a 55% reduction in crimp length, all while maintaining full LV214 qualification.
• Enhanced Connection Security: Features anti-scooping design, secondary locking system, and Kojiri connector design for secure connections.
• Manufacturing Efficiency: Simplifies manufacturing with automated pin insertion and S-bending solder pin design for precise header board positioning, reducing pin length by 4 mm (42% shorter).

Key Features:

• Pin-to-Pin Pitch: 1.27 mm
• Vibration Grade: SG2
• Wire Range: 0.13 mm² to 0.22 mm²
• Current Capacity: 4 A at +90°C
• Mating Blade Size: 0.5 mm x 0.4 mm
• Header Design: S-bended pin
• Maximum Temperature: +130°C (Sn) / +150°C (Ag)
• Compliance: Automotive standard LV214
• Locking Mechanisms: Primary and secondary contact locking with a click-audible connector position assurance (CPA) possible
• Electrical Specifications: Clearance and creepage distance suitable for 12 V applications
• Future Developments: FFC terminal in development
• Configurations: Available in 2- to 10-position side latch housings and headers, and receptacle options (0.22 FLU and FLR, 0.13 FLR)

Applications:

• Automotive Lighting: Headlamps and indicators
• Controls: Steering wheel controls
• Cameras: Front and rear cameras
• Sensors and Modules: Switches, sensors, roof controls, and antenna modules
• HVAC Systems
• Electrical Systems: Wire harnesses and electrical systems
• Audio Systems: Audio modules
• Battery Management: Battery applications, including battery management systems and battery/cell control modules