Ultrathin 12A µModule regulator is configurable as quad, triple, dual or single output

Posted By : Barney Scott
Ultrathin 12A µModule regulator is configurable as quad, triple, dual or single output

Linear introduces the LTM4643 quad output step-down µModule (power module) regulator, configurable as a single output (12A), dual (6 & 6A or 9 & 3A), or quad (3A each) regulator in a 9x15x1.82mm ultrathin LGA package. This flexibility enables system designers to rely on one simple and compact µModule regulator for a variety of voltage and load current requirements in FPGA, GPU, ASIC and processor-based applications.

The 1.82mm height ultrathin package allows the LTM4643 to be mounted on the backside of the PCB, freeing space on the topside for components such as memory and connectors. The LTM4643 is suitable for systems with height restrictions, such as backside PCB assembly in PCIe applications and where the regulator must fit under a common heat sink or cold plate to cool high power FPGAs, GPUs, ASICs and processors in applications such as embedded computing, data storage, medical imaging and industrial systems.

Only eight external ceramic capacitors (1206 or smaller case sizes) and four feedback resistors (0603 case size) are required to regulate four independently adjustable outputs between 0.6 to 3.3V. Separate input pins enable powering of the four channels from different or a common supply rail(s) from 4 to 20V.

The four channels are switched 90° out-of-phase to minimize input ripple at the 1.2MHz default switching frequency or synchronized to an external clock between 850kHz and 1.5MHz. With the addition of an external bias supply above 4V, the LTM4643 can regulate from an input supply voltage as low as 2.375V. Output overvoltage, overcurrent and overtemperature fault protection are included in the regulator.

The LTM4643 is available with operation specified over the -40 to 125°C internal temperature range. The μModule regulator is available for immediate delivery from stock.

Downloads


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

CES 2018
9th January 2018
United States of America Las Vegas, Nevada
Developing wearable products: technology and opportunities
17th January 2018
United Kingdom Cocoon Networks, London
Smart Mobility Executive Forum
12th February 2018
Germany Berlin
embedded world 2018
27th February 2018
Germany Nuremberg
Industry 4.0 Summit 2018
28th February 2018
United Kingdom Manchester