Toshiba Electronics - Low-voltage, high-current MOSFETs for high-speed switching applications available in new 3.3 x 3.3 mm TSON Advance package

9th August 2011
Posted By : ES Admin
Toshiba Electronics - Low-voltage, high-current MOSFETs for high-speed switching applications available in new 3.3 x 3.3 mm TSON Advance package
Toshiba Electronics Europe (TEE) has extended its family of 30V power MOSFETs with new devices that combine high-speed switching, high current ratings and compact package size. The latest devices in the TPCx family are ideal for a wide variety of digital home appliances, office equipment and other products that require synchronous rectification DC/DC conversion.
Family for DC/DC conversion and synchronous rectification includes TSON advance format with 64% smaller footprint than SOP 8 equivalents

Based on Toshiba’s 7th generation, high-speed UMOS VII-H semiconductor process, the latest additions to the TPCx family of low withstand voltage power MOSFETs comprises nine devices in SOP-8 and the new TSON Advance package formats. The latter bridges the gap between industrial standard SOT23 and SOP8 package formats - at just 3.3mm x 3.3mm this package format delivers a 64% smaller footprint than a SOP-8 device with an equivalent power rating.
Toshiba’s UMOS VII-H low-voltage trench structure allows the new MOSFETs to deliver a combination of low on resistance (RDS(ON)) and high-speed switching characteristics. In addition a low internal gate resistance and a low Cgd/Cgs gate capacitance ratio helps to prevent the possibility of self turn-on.

All of the new MOSFETs have a maximum VDSS rating of 30V and a maximum VGSS rating of ±20V. Typical RDS(ON) values (VGS = 10V) range from 20mΩ down to just 6.0mΩ depending on the device chosen. TPC806x-H and TPC822x-H devices are supplied in SOP-8 and dual Chip SOP-8 packages respectively. TPCC806x-H parts in the TSON advanced package achieve a power dissipation of 1.9W, due to a metal base plate.

You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

EMO Hannover 2019
16th September 2019
Germany Hannover
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
HETT 2019
1st October 2019
United Kingdom EXCEL, London
World Summit AI 2019
9th October 2019
Netherlands Taets Park, Amsterdam
New Scientist Live 2019
10th October 2019
United Kingdom ExCeL, London