Rectifiers save space, improve thermal performance
A family of surface-mount TMBS Trench MOS Barrier Schottky rectifiers in the eSMP series SlimDPAK (TO-252AE) package have been released by Vishay Intertechnology. Offering lower profiles and better thermal performance than devices in the DPAK (TO-252AA), the Vishay General Semiconductor rectifiers feature reverse voltages from 45V to 150V, low forward voltage drop, and industry-high current ratings.
By combining TMBS technology with the SlimDPAK package, the 40 Schottky rectifiers deliver current ratings up to 35A for single-chip configurations and 40 A for dual-chip, center-tap common cathode configurations.
Footprint-compatible with the DPAK package, the devices’ profile is 43% lower, enabling ultra slim industrial and consumer electronics designs.
In addition, their heatsink area is 14% larger, allowing for typical thermal resistance down to 1.5°C/W.
With their forward voltage drop down to 0.44V at 20A, 0.46V at 35A, and 0.49V at 40A, the rectifiers reduce power losses and improve efficiency in DC/DC converters and freewheeling and polarity protection diodes.
For automotive applications, the devices are also available in an AEC-Q101 qualified version.
The rectifiers feature a maximum operating junction temperature up to +175 °C and an MSL moisture sensitivity level of 1, per J-STD-020, LF maximum peak of +260 °C. Ideal for automated placement, the devices are RoHS-compliant and halogen-free.
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