Power modules provide a low transient thermal resistance

25th November 2014
Posted By : Siobhan O'Gorman
Power modules provide a low transient thermal resistance

To address the specific requirements of cost-effective applications, Infineon Technologies has released bipolar power modules in solder bond technology. The PowerBlock modules expand the company’s power module portfolio which, thus far, was only using pressure contacts. Infineon offers optimised solutions for different applications like industrial drives, renewable energy, soft starters, UPS systems, welding and static switches driven by cost and/or performance restrictions.

With market prices of approximately 25% (depending on module/application) less than related pressure contact variants, solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder PowerBlock modules are suitable for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must. Whenever high robustness is a key criterion, like for soft starters or static switches, Infineon offers the pressure contacts as a solution. For example, in an input rectifier application directly operating under harsh line voltage conditions the requirements for robustness increase with module size, demanding for the highly reliable pressure contact technology.

The PowerBlock modules are available in package types with base plate widths of 20, 34 or 50mm. For each package five module types for easy rectifier designs are offered: twoThyristor/Thyristor TT, two Thyristor/Diode TD and one Diode/Diode DD. Infineon is covering the main current ratings per package size; all types are available with 1600V blocking voltage. The company is the only European vendor offering 20, 34 and 50mm modules for different application requirements - modules in solder bond technology for cost optimised industrial standard solutions and modules in pressure contact technology for high current applications and highest reliability.

The PowerBlock modules with isolated copper base plate provide a lower transient thermal resistance than modules using only a DCB substrate for heat transfer to the heat sink. This leads to higher robustness in case of overload. The optimised housing and cover construction of the PowerBlock solder modules provide a very low torsion during screwing of the main terminals while the modules offer best in class soldering quality. In addition the modules show low power dissipation which leads to high system efficiency.

Infineon starts mass production of the 1600V PowerBlock modules (20 and 34mm) with solder bond technology and different current classes in Q4, 2014. In addition, first samples of the 1600V PowerBlock 50mm solder modules will be available starting Q1, 2015. The bipolar power modules will be showcased at booth 348 in hall 1 at the SPS IPC Drives trade fair in Nuremberg from 25th to 27th November 2014.

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