Low-profile 5A power module targets telecomms & SSDs
Designed specifically for height-constrained telecomms, industrial and SSD applications, an integrated switching power module has been unveiled by Microchip. The MIC45404 integrates inductors and passive components in a 10x6x2mm thermally-enhanced package, which saves space, simplifies board design and eliminates concern over passive components that may introduce unexpected EMI.
According to IHS, the global power-module market is projected to comprise nearly one third (30%) of the power semiconductor market by 2019, growing at twice the rate of power discretes (from 2014 to 2019). Microchip is well-positioned in this market, in part because it has developed a process that puts all passives on a thermally-enhanced lead-frame that reduces the distance between the components, which minimises radiated emissions and improves thermal dissipation.
The MIC45404 incorporates one of the thinnest integrated magnetic inductors available in a 19V, 5A PoL buck converter. Integrated components include the controller, MOSFETs, feedback path and PWM switching regulator. The low profile of the module allows it to be placed on the back of a PCB, on a daughter card or other placement where vertical height may be constrained in PoL power conversion, telecomms and industrial applications.
The MIC45404 is available for sampling and volume production in a 10x2x6mm QFN package. Pin-selectable output voltages, switching frequencies and current limits provide further design flexibility and space savings. Microchip also offers the MIC45404 evaluation kit (MIC45404YMP-EV), priced at $55.00, which enables application development with the integrated switching power module.
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