Features of LD6806 Series
NXP’s new LD6806 LDO series features a very low noise performance of only 30 μVRMS, which helps prevent changes in the regulated output voltage and eliminates the need for an external dedicated noise-reducing capacitor.
Battery-powered applications are also supported by the low standby current of 0.1 μA (typ), which reduces power
consumption and improves battery efficiency.
The LD6806 series also features outstanding ESD robustness of 10 kV (HBM), thermal shutdown, and a current limiter to protect circuits. Package options include the LD6806F in a very small DFN1410-6 (SOT886) leadless package with dimensions of only 1.45 x 1.0 x 0.5 mm, or the LD6806TD in a 5-pin SOT753 general-purpose consumer package with standard dimensions of 2.9 x 1.5 x 1.0 mm.
In addition to these package options, the NXP low-dropout voltage regulator product portfolio also includes high PSRR performance LDOs with 75 dB, such as the LD6805K in an ultra-small lead-free QFN package (SOT1194), with dimensions of only 1.0 x 1.0 mm and a height of 0.55 mm (max).
In its Q3 2011 Power Management Tracker, analyst firm Databeans forecasts that the worldwide market for LDO voltage regulators will reach $3.293 billion by 2016.
“Voltage regulators play a critical role in managing the power efficiency and performance of battery-powered electronic devices. At NXP, our view is that both LDOs and DC/DC converters are necessary to serve the individual voltage requirements with a high power efficiency, a low noise level and in a small package, particularly with the rapid proliferation of portable devices such as smartphones, music players and tablets. Through our broad portfolio in Standard Products and the economies of scale and quality we deliver in manufacturing, NXP offers significant advantages to system designers who want to make the most of our world-class expertise in energy efficiency, component integration and package technology,” said Dr. Dirk Wittorf, marketing director, Integrated Discretes product line, NXP Semiconductors.
“Our newest LDOs for mobile applications take advantage of NXP’s expertise in wafer-level chip-scale package technology and combine this with the best dropout performance available. This enables mobile phone designers to extend battery lifetime and minimize board space, both of which are at a premium. As a validation of our approach, one major mobile OEM has given us the best rating for the mechanical performance of our LDOs in chip-scale packages,” said Frank Hildebrandt, international product marketing manager, Integrated Discretes product line, NXP Semiconductors