High density AC/DC power supplies housed in low profile packages

19th October 2017
Source: CUI Inc
Posted By : Anna Flockett
High density AC/DC power supplies housed in low profile packages

The power group of CUI has announced the addition of 275, 350, and 550W models to its VOF family of open frame AC/DC power supplies. The VOF‑275, VOF‑350, and VOF‑550 series are housed in compact, low profile packages measuring as small as 3x5x0.75” (76x127x19mm) with high power densities up to 24.4 W/in³.

Coupled with high efficiencies up to 94% and no-load power draw as low as 0.5W, these open frame AC/DC power supplies are suited for IT equipment, industrial, and telecom applications where space and energy consumption are of major concern.

The three new VOF series offer output voltage options from 12-58Vdc and feature wide universal input voltage ranges up to 80-264 Vac. Certified to the UL and EN 60950-1 safety standards, the power supplies further meet EN 55032 B requirements for conducted and radiated emissions. All models also provide power factor correction, a 12Vdc/500 mA fan output, and protections for over voltage, over current, and short circuit.

Operating temperatures range at full load from -40 up to 50°C with forced air cooling, de-rating to 50% load at 70°C. The high density AC/DC power supplies also carry an MTBF of 3.37 million hours, calculated per Telcordia SR-332 Issue 3.

Downloads


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Maintec 2018
6th November 2018
United Kingdom NEC, Birmingham
electronica 2018
13th November 2018
Germany Messe Munchen
SPS IPC Drives 2018
27th November 2018
Germany Nuremberg
International Security Expo 2018
28th November 2018
United Kingdom London Olympia
The Security Event 2019
9th April 2019
United Kingdom NEC, Birmingham