Power

Expanding system protection devices with integrated power switches

15th November 2016
Anna Flockett
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Continuing to compete on the market, Silego has announced five more robust GFET3 and HFET1 integrated power switches (IPSs) designed to operate over the -40°C to 125°C extended industrial temperature range.

Addressing PCB-space-constrained applications in the industrial, in-cabin infotainment, and enterprise/embedded computing markets, these five products include a suite of system-level protection features. In space-constrained applications, elevated operating temperatures place additional performance burdens on system protection devices. In many cases, system designers are forced to select less robust products or implement discrete, PCB-space-consuming alternatives when in-circuit ambient temperatures exceed 85°C or 105°C.

For supply-voltage applications up to 5V, Silego announced the 8.4mΩ/4 A SLG59M1657V, the 17mΩ/2.5 A SLG59M1658V, and the 13mΩ/3.5 A SLG59M1707V. In addition, the SLG59M1707V’s analogue current monitor output feature offers substantial system BOM cost/PCB savings by eliminating the need for an external current shunt resistor, a difference/level-shifting amplifier, and associated passive components to measure directly FET current. Depending upon the application’s maximum operating current, PCB footprints range from 1.6-4 mm2.

For supply-voltage applications up to 24V, Silego designed the 13.3mΩ/4 A SLG59H1013V and the 13.1mΩ/3.5 A SLG59H1016V, in 4.8mm2 package sizes. Like the SLG59M1707V, both products include an analogue current monitor feature, an open-drain (‘FAULT’) output, and fast output voltage discharge.

Using Silego’s proprietary MOSFET design IP, these extended industrial temperature range, robust integrated system protection devices maintain ultra-stable, low RDSONs across the applied input voltage range. Applying Silego’s proprietary CuFET technology, Silego’s design engineers deftly package these products in low thermal-resistance, RoHS-compliant footprints that generate low thermal gradients in these space-constrained, high-current applications.

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