DC link capacitor designed for IGBT modules

18th August 2016
Posted By : Daisy Stapley-Bunten
DC link capacitor designed for IGBT modules

An EPCOS DC link capacitor that has been specifically designed for the HybridPACK 1-DC6 IGBT module from Infineon Technologies has been presented by TDK Corporation. The outstanding features of this component are the six busbar terminals with dimensions that are matched precisely to fit the IGBT module. This multiple contacting produces an excellent current capability while at the same time offering very low parasitics.

For example, the ESR has a maximum value of 0.6mΩ and the ESL value is just 25nH. Thanks to this low ESL, voltage peaks on switching off the IGBTs are almost completely eliminated.

The capacitor with the order number B25655P4607J021 is designed for a rated voltage of 450VDC and offers a capacitance of 600µF. Its current capability is about 150A at a maximum ambient temperature of 105°C and a cooled temperature on the underside of 75°C. The component is designed using Power Capacitor Chip (PCC) technology in which the capacitor element is constructed as a stacked winding, with which a volume fill factor of nearly 1 is achieved. The dimensions of the housing are correspondingly compact, at just 140x72x50mm.

Furthermore, a flat winding version is offered in the same housing (B25655P4477J121). This type has a capacitance of 470µF and is likewise designed for 450VDC. At a maximum ambient temperature of 105°C and a cooled temperature on the underside of 75°C, its current capability is about 150A. The ESR value of this design is 0.8mΩ and the ESL value is 25nH.

Apart from the standard version, the capacitor is also available with an additional connection for the EPCOS high-voltage DC EMC filter. All in all, the combination of the IGBT module with the new link circuit capacitor enables the design of extremely compact inverters for xEV applications or for use as industrial inverters.

Main applications:

  • DC link capacitor for HybridPACK 1-DC6 from Infineon Technologies

Main features and benefits:

  • low ESL of just 25nH
  • minimum ESR of just 0.6mΩ
  • compact dimensions of just 140x72x50mm

You must be logged in to comment

Write a comment

No comments

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

19th May 2019
Sensor+Test 2019
25th June 2019
Germany Nürnberg Messe
DSEI 2019
10th September 2019
United Kingdom EXCEL, London
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
Engineering Design Show 2019
16th October 2019
United Kingdom Ricoh Arena, Coventry