Power

Bus converter modules first to utilise ChiP platform

15th January 2014
Staff Reporter
0

The first module in the BCM series of ChiP bus converter modules has been released by Vicor. Utilizing Vicor's exisiting Converter housed in Package (ChiP) power component platform, the device supplies 1.2kW at 48V, with 98% peak efficiency and 115W/cm3 power density. Claiming 4x the density of competing solutions, the device is designed to provide efficient, high voltage DC distribution infrastructure in datacenter, telecom, and industrial applications.

Supplying an isolated 48V distribution bus with a peak efficiency of 98%, the device also features a nominal input voltage of 380V and a K-factor of 1/8. With its input range of 260 to 410 V, the BCM device supports outputs ranging from 32.5V to 51.25V. The device is based on Vicor’s ZCS/ZVS Sine Amplitude Converter topology and operate at a 1.25MHz switching frequency, providing fast response time and low noise operation.

Available in the 6123 ChiP package, the 380 VDC VI Chip BCMs measure 63mm x 23mm, with a height of 7.3mm. Whilst initially offered as a through-hole device, package options will also include SMD variants. The converter modules may be paralleled to provide multi-kW arrays and are capable of bi-directional operation to support battery backup and renewable energy applications. Standard device features include under-over-voltage lockout, over-current, short circuit and over-temperature protection. ChiP BCMs incorporate digital telemetry and control features that can be configured to meet customer requirements.

“The roll-out of high voltage DC distribution infrastructure is yielding reduced power consumption and operational costs for datacom and industrial facilities,” said Stephen Oliver, VP of VI Chip product line, Vicor. “ChiP BCMs provide superior efficiency, density and flexibility – the hallmark benefits of the ChiP platform.”

The ChiP platform leverages advanced magnetic structures integrated within high density interconnect (HDI) substrates, with power semiconductors and control ASICs. This provides superior thermal management supporting unprecedented power density. Using the thermally-adept ChiPs, customers can achieve low cost power system solutions with previously unattainable system size, weight and efficiency attributes, quickly and predictably. ChiPs exemplifies a modular power system which enables designers to achieve high performance, cost-effective power systems from AC or DC sources to the Point of Load using proven building blocks.

“ChiPs will enable power system architects to overcome the power density constraints imposed by conventional power solutions,”said Patrizio Vinciarelli, CEO, Vicor. “ChiPs maximize performance while minimizing development cost and time to market, yielding superior solutions with the flexibility and scalability of modular building blocks.”

Vicor’s 6123 VI ChiP BCMs are available today. Pricing for OEM quantities is $120.00. 

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