MIRTEC to Premier New Line of AOI Systems at APEX 2011

“Since then, we have developed a 10M pixel variant of the ISIS product line, allowing us to address a more budget conscious consumer while still providing twice the native resolution of our nearest competitors,” D’Amico added. “This year, we will be showing this advanced camera technology adapted across our entire product line of AOI and SPI equipment. We also are very excited to unveil MIRTEC’s latest advancements in 3D AOI inspection Technology at APEX 2011.”



MIRTEC will feature an MV-7xi configured with the exclusive 15 Mega Pixel ISIS Vision System and proprietary 3D AOI technology in booth #1925 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 in Las Vegas. All attendees are invited to visit with MIRTEC for a first-hand demonstration of this new technology.



MIRTEC also will exhibit an MV-7xi In-Line AOI System configured with one Top-Down View Ten Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) Ten Mega Pixel Side-View Cameras. The patented “Quad Angle Lighting System” provides four independently programmable zones for optimal illumination of inspection areas. The MV-7xi on disaply at APEX will feature a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under board support system. The system also will be configured with MIRTEC’s exclusive Intelli-Scan Laser System. This advanced technology offers superior lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability. The MV-7xi is powerful yet simple to use. A comprehensive Package Type Library provides simple “Drag and Drop” component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.



The MIRTEC MV-3L Desktop AOI System is the industry’s most widely accepted five camera desktop AOI system. New to IPC APEX 2011, MIRTEC will display an MV-3L configured with a Top-Down View Ten Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) Ten Mega Pixel Side-View Cameras. It also features the Intelli-Beam Laser System. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.