High performance power amplifiers for high potential WiMAX applications

1st May 2008
ES Admin
To meet the fast growing demand for components complying with the upcoming WiMAX standard, UK specialist distributor, Admiral Microwaves has launched a range of new power amplifiers. Designed and developed by RF Integrated Corporation (RFIC), these devices are exclusively available for the first time in the UK from Admiral.
The AP3011 covers the key frequency ranges specified for WiMAX applications, from 2.3 to 2.7GHz. This is the most popular band for WiMAX technology systems in the US and most Asian and European countries. WiMAX is also expected to expand rapidly in many developing countries with a poor wired or broadband infrastructure. It will be incorporated into handheld devices once the standard is fully deployed. Primary applications for the power amplifiers include IEEE 802.11b/g, and 2.4 GHz ISM Band wireless systems, as well as IEEE 802.16 (WiMAX) systems. In addition, they will prove useful in a range of high power WLAN applications.

The AP3011 is a linear, three stage power amplifier with high output power in the 2.3 to 2.7GHz band, and featuring very stable performance throughout the whole bandwidth. With excellent linearity and high gain from 30.5 to 35dB, the devices deliver 22.5dBm output power at data rates up to 54Mbits/s, with OFDM modulation and 3% EVM at 3.3V. Also suitable for IEEE 802.11g schemes, they offer 26dBm linear power at 5V. The power amplifiers include an on-chip power detector which provides a DC voltage proportional to the output power of the device.

These power amplifier MMICs are fabricated using an InGaP/GaAs HBT process and are supplied in 3x3mm, 16pin, QFN leadless packages. The devices are highly cost competitive and readily available in production volumes on standard lead times. Samples are available for immediate delivery from Admiral Microwaves.

RFIC has been designing advanced wireless LAN components since 2000, and is currently regarded as one of the leading solution providers worldwide. Its product range covers low power Bluetooth, cellular and fibre optic components. With operations in the US, Far East and China, this fabless design house has formed strong partnerships with world class GaAS HBT, P-HEMT and RF CMOS technology-based wafer foundries and packaging/test centres as well as system houses supplying baseband/transceiver chips, to provide the total solution.

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