Two new 40mm die pressure contact phase control thyristors

3rd December 2013
Source: IXYS
Posted By : Staff Reporter
Two new 40mm die pressure contact phase control thyristors

Two new 40mm die pressure contact phase control thyristors have been announced b y IXYS UK. With current ratings of 075A & 1140A and voltage ratings of 1800V & 1400V respectively, these new devices from IXYS will eventually replace some of the older designs in the same mechanical footprint.

The N1075LN180 (Vdrm/Vrrm 1800 Volts and Itav 1075A) and N1140LN140 (Vdrm/Vrrm 1400 Volts and Itav 1140A) incorporate larger die sizes into the same mechanical footprint of IXYS' established products and offer improved performance. The design includes a new silicon die with advanced thermal bonding to a metal disc and encapsulated in a rugged hermetic ceramic packages. The new improved package design includes fewer material interfaces and a much improved gate contact, with reduced thermal resistance and enhanced electrical performance. The devices, which have 34mm electrode diameter, 58mm overall diameter and 26mm package height comply with the Jedec TO200AB outline.

“These two new introductions complete the family of high performance, hermetic, compact press-pack devices which IXYS has added to its portfolio for high power applications. Extensive internal testing has shown that these new devices are very rugged, very efficient with the double sided die cooling and with enhanced thermal cycling performance,” commented Frank Wakeman, IXYS UK’s Marketing and Technical Support Manager.

Typical applications include soft starters, DC drives, and all controlled rectifier applications which require the higher reliability of a press-pack at these current and voltage ratings.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Building IoT products for smart healthcare market
8th February 2018
United Kingdom Cocoon Networks, London
Smart Mobility Executive Forum
12th February 2018
Germany Berlin
Medical Japan 2018
21st February 2018
Japan INTEX Osaka
Mobile World Congress 2018
26th February 2018
Spain Barcelona
embedded world 2018
27th February 2018
Germany Nuremberg