TVS diode packaging enables 66% greater clamping performance
Two new packaging options for Littlefuse's SP3012 Series TVS Diode Array line has been announced. Offering board designers more options and greater layout flexibility, the SP3012-03UTG (uDFN-6) and SP3012-04HTG (SOT23-6) devices also claim to offer up to 66% greater clamping performance than other industry options. This feature ensures greater chipset reliability.
Additional benefits include an ultra-low capacitance of 0.5pF, which minimises signal degradation and distortion for high-speed applications such as HDMI 1.3/1.4 and USB 2.0, USB 3.0, DisplayPort, etc. The devices feature low dynamic resistance of 0.4Ω, providing low clamping voltages to protect sensitive high-speed chipsets. The ESD capability is a minimum of ±12kV (contact) and ±25kV (air), which exceeds the highest level of the IEC61000-4-2 standard (Level 4). Further to this, the small form factor packages simplify the PCB layout by allowing the traces to run directly underneath the device and save valuable board space.
Typical applications for these new additions to the SP3012 Series include ultrabooks, LCD TVs, set-top boxes, Ethernet switches, etc.
“With a dynamic resistance of just 0.4 ohms, the SP3012-03UTG and SP3012-04HTG provide a much lower clamping voltage than other devices available in the industry, which helps to ensure more reliable equipment performance in the field,” commented Chad Marak, Product Line Director, TVS Diode Arrays. “Additionally, their ultra-low capacitance minimizes signal degradation so the design engineer doesn’t have to trade off protection for system performance.”
Samples of the SP3012-03UTG (uDFN-6) and SP3012-04HTG (SOT23-6) devices are available now.
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