TVS diode arrays combine low capacitance & low leakage

22nd July 2016
Posted By : Nat Bowers
TVS diode arrays combine low capacitance & low leakage

Littelfuse has introduced two series of low capacitance TVS diode arrays optimised for protecting the NFC circuits of smartphones, tablets and other portable communication products from ESD damage. The SP3118 and SP3130 series TVS diode arrays include back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology that absorb repetitive ESD strikes safely up to the maximum level specified in the IEC61000-4-2 international standard without performance degradation.

Their back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. The SP3118 and SP3130 series provide best-in-class leakage performance when compared with other industry solutions. Low leakage current performance is essential for any component used in battery-operated, power hungry devices.

Applications for the SP3118 and SP3130 series include tablets, ultrabooks, e-readers, smartphones, digital cameras, MP3/PMP players, set-top boxes, portable medical devices, and electronics enabled by NFC and Felicity Card (FeliCa) protocols.

Tim Micun, Product Manager, TVS Diode Arrays, Littelfuse, commented: “The nominal voltages for the data antenna lines that the SP3118 and SP3130 series are designed to protect are less than 3V. During antenna mismatch events, the interfaces of these products may experience up to five times the nominal voltage encountered during an NFC handshake. These new TVS Diode Arrays permit the elevated signal voltages to pass and distinguish them from ESD events.”

The SP3118 and SP3130 series are provided in tape & reel packaging in quantities of 10,000. Sample requests can be placed through authorised Littelfuse distributors worldwide.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Building IoT products for smart healthcare market
8th February 2018
United Kingdom Cocoon Networks, London
Smart Mobility Executive Forum
12th February 2018
Germany Berlin
Medical Japan 2018
21st February 2018
Japan INTEX Osaka
Mobile World Congress 2018
26th February 2018
Spain Barcelona
embedded world 2018
27th February 2018
Germany Nuremberg