Thin film chip resistors reduce thermal resistance

31st July 2014
Source: Vishay
Posted By : Nat Bowers
Thin film chip resistors reduce thermal resistance

Offering power ratings of 2 and 6W in compact 1206 and 2512 case sizes, the PCAN series of high-power, surface-mount precision thin film chip resistors has been announced by Vishay Intertechnology. The aluminium nitride substrates of the resistors have enlarged backside terminations in order to reduce the thermal resistance between the topside resistor layer and the solder joint on the end user's circuit assembly.

According to Vishay, the reduced thermal resistance enables the devices to provide four times the power handling capability of commercial chip resistors. This makes the devices suited for use in power supplies for industrial, telecommunications, test and measurement, medical and military and aerospace equipment and instrumentation.

Operating over a wide temperature range from -55 to +150°C, the PCAN series resistors feature low TCR of ±25ppm/°C, laser-trimmed tolerances down to ±0.1%, noise of less than -30dB and low voltage coefficients of 0.1ppm/V. The high-power, surface-mount devices are available with a wide range of resistance values in the range of 30-175Ω and voltage ratings of 75-200V.

The resistors' wraparound terminations are lead (Pb)-free, RoHS-compliant and flame-resistant in accordance with UL 94 V-0. Lead (Pb)-bearing, wire-bondable gold, and epoxy-bondable (glueable) gold terminations are available upon request.

The PCAN series high-power, surface-mount precision thin film chip resistors are available now for sampling and in production quantities. Lead times are eight weeks for large orders.

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