Resistors feature AgPd terminations for conductive gluing

7th July 2016
Source: Vishay
Posted By : Nat Bowers
Resistors feature AgPd terminations for conductive gluing

Vishay Intertechnology has introduced a series of sulfur-resistant thick film chip resistors with silver/palladium (Ag/Pd) terminations for conductive gluing. Featuring a robust design for automotive and industrial applications, the AEC-Q200-qualified RCA-AP e4 series devices provide advanced sulfur resistance and high operating temperatures to +175°C.

Featuring a unique flip chip design, the space-saving resistors released today offer a reduced package footprint compared to solderable devices, while delivering low parasitic capacitance and inductance. For high-sulfur environments, the RCA-AP e4 series features a sulfur withstand ability in accordance with ASTM B809-95, tested at an advanced level of +90°C for 1,000 hours. The devices are optimised for hybrid circuit applications in high-temperature environments.

RCA-AP e4 series resistors are available in the 0603 case size and offer power ratings to 0.15W at +70°C. The RoHS-compliant, halogen-free devices provide a resistance range from 1Ω to 10MΩ with tolerances of ±1% and ±5%, TCR of ±100ppm/K and ±200ppm/K, and an operating voltage of 75V.

Samples and production quantities of the RCA-AP e4 series are available now, with lead times of 10 weeks.

Downloads


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Southern Manufacturing & Electronics 2019
5th February 2019
United Kingdom Farnborough
embedded world 2019
26th February 2019
Germany Nuremberg
Wearable Tech Show 2019
12th March 2019
United Kingdom London
AMPER 2019
19th March 2019
Czech Republic Brno Exhibition Centre