Resistors feature AgPd terminations for conductive gluing

7th July 2016
Source: Vishay
Posted By : Nat Bowers
Resistors feature AgPd terminations for conductive gluing

Vishay Intertechnology has introduced a series of sulfur-resistant thick film chip resistors with silver/palladium (Ag/Pd) terminations for conductive gluing. Featuring a robust design for automotive and industrial applications, the AEC-Q200-qualified RCA-AP e4 series devices provide advanced sulfur resistance and high operating temperatures to +175°C.

Featuring a unique flip chip design, the space-saving resistors released today offer a reduced package footprint compared to solderable devices, while delivering low parasitic capacitance and inductance. For high-sulfur environments, the RCA-AP e4 series features a sulfur withstand ability in accordance with ASTM B809-95, tested at an advanced level of +90°C for 1,000 hours. The devices are optimised for hybrid circuit applications in high-temperature environments.

RCA-AP e4 series resistors are available in the 0603 case size and offer power ratings to 0.15W at +70°C. The RoHS-compliant, halogen-free devices provide a resistance range from 1Ω to 10MΩ with tolerances of ±1% and ±5%, TCR of ±100ppm/K and ±200ppm/K, and an operating voltage of 75V.

Samples and production quantities of the RCA-AP e4 series are available now, with lead times of 10 weeks.

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