Resistors feature AgPd terminations for conductive gluing

7th July 2016
Source: Vishay
Posted By : Nat Bowers
Resistors feature AgPd terminations for conductive gluing

Vishay Intertechnology has introduced a series of sulfur-resistant thick film chip resistors with silver/palladium (Ag/Pd) terminations for conductive gluing. Featuring a robust design for automotive and industrial applications, the AEC-Q200-qualified RCA-AP e4 series devices provide advanced sulfur resistance and high operating temperatures to +175°C.

Featuring a unique flip chip design, the space-saving resistors released today offer a reduced package footprint compared to solderable devices, while delivering low parasitic capacitance and inductance. For high-sulfur environments, the RCA-AP e4 series features a sulfur withstand ability in accordance with ASTM B809-95, tested at an advanced level of +90°C for 1,000 hours. The devices are optimised for hybrid circuit applications in high-temperature environments.

RCA-AP e4 series resistors are available in the 0603 case size and offer power ratings to 0.15W at +70°C. The RoHS-compliant, halogen-free devices provide a resistance range from 1Ω to 10MΩ with tolerances of ±1% and ±5%, TCR of ±100ppm/K and ±200ppm/K, and an operating voltage of 75V.

Samples and production quantities of the RCA-AP e4 series are available now, with lead times of 10 weeks.

Downloads


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

SINDEX 2018
28th August 2018
Switzerland BERNEXPO-Site, Bern
European Microwave Week 2018
23rd September 2018
Spain Ifema Feria De Madrid
Connected World Summit 2018
25th September 2018
United Kingdom Printworks, London
IoT Solutions World Congress 2018
16th October 2018
Spain Barcelona
Engineering Design Show 2018
17th October 2018
United Kingdom Ricoh Arena, Coventry