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Syfer - Process improvements power up capacitor range

17th February 2010
ES Admin
0
Developments in manufacturing processes and materials technology have led to significant extensions in Syfer Technology’s range of 100V and 200V X7R surface mount MLCCs (multilayer chip capacitors).
/> As a result (see table below), values have increased dramatically, delivering up to double the capacitance in the same size package as previously. This ability to reduce package size or increase capacitance range will prove critical to meeting today’s tight design constraints.

The range extensions are a direct result of Syfer’s continuous quality improvement programmes, such as Lean and 6 Sigma, as well as material and process developments. An important area targeted for improvement is the ‘wet process’, where the wet ceramic and electrodes are printed layer by layer under automatic computer control. This is a critical stage in the manufacture of ceramic capacitors, and these specialist materials have been subject to on-going improvements, yielding positive results. In addition, greater control through automation, over all parts of the manufacturing cycle, has further contributed to ever-increasing capacitance values.

The improved MLCC ranges, now with voltages up to 200V in the X7R dielectric, are eminently suitable for applications in power supplies, dc-dc converters, automotive and aerospace equipment. They are also available with FlexiCap™ terminations using Syfer’s proprietary flexible epoxy polymer termination material, which make these devices considerably more resistant to damage through bending or flexing, and when under stress and temperature cycling extremes.

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