One giant leap in the miniaturisation of space electronics

4th December 2017
Posted By : Alice Matthews
One giant leap in the miniaturisation of space electronics

Manufacturer of high-rel passive components designed for harsh environments, Exxelia, has taken a step forward in the miniaturisation of electronics for space applications. The company has announced that its CEC and CNC series of low voltage ceramic capacitors have received the QPL certification based on ESCC n°3009 specification, for the 0402 case size. It is the smallest QPL-certified case size completing Exxelia’s MLCCs QPL-listed ranges. QPL references are now available from case sizes 0402 to 2220, from 10-100V.

Exxelia ranges of low voltage MLCC for surface mounting, CEC19 and CNC19, have achieved the Qualified Part List (QPL) status under the criteria of the European Space Component Coordination’s (ESCC) 3009/042 and 3009/043 respectively. The case size 0402 QPL-qualified parts are available from 10-25V, enabling substantial miniaturisation and cost-saving.

Dielectrics are based either in the very stable NPO (type 1) or the high capacitance X7R (type 2). CEC and CNC series combine high capacitance values with high thermal and voltage stability. Versions with polymer terminations are also QPL-certified.

These ranges of versatile chip capacitors are intended for use in a variety of aerospace applications requiring the highest level of reliability: satellites, launch vehicles, payloads.

CEC19 features:

  • Stable NPO dielectric
  • Maximum capacitance values: 330pF in 10V, 120pF in 16V and 100pF in 25V
  • Large operating temperatures: -55 to 125°C

CNC19 features: 

  • High capacitance X7R dielectric
  • High capacitance rating values: from 68pF to 12nF in 10V, 8.2nF in 16V and 5.6nF in 25V
  • Large operating temperatures: -55 to 125°C.


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