Mini-TurboCap capacitors now available in 25V, 50V, and 100V

4th November 2013
Source: AVX
Posted By : Nat Bowers
Mini-TurboCap capacitors now available in 25V, 50V, and 100V

AVX has today announced an expansion of its Mini-TurboCap and RoHS Compliant Mini-TurboCap Series with a new 25V rating. They have also enhanced the extended capacitance range for its 50V parts up to 39µF. Offering extremely high volumetric efficiency, ultra low ESR and ultra low ESL in a compact footprint, these base metal electrode capacitors are now available in 25V, 50V, and 100V.

Pat Hollenbeck, applications engineer at AVX, comments: “The extended voltage and capacitance ratings for our Mini-TurboCap Series BME capacitors are especially beneficial developments for design engineers working in a variety of critical markets, as there are no other capacitors on the market that can match their high CV capabilities in a similarly small footprint.”

Both Mini-TurboCap Series are ideal for I/O EMI filtering in military and COTS+ switch mode power supply applications, industrial power converters, radar systems, aerospace power electronics and more. Both comprised of X7R dielectric materials, the Mini-TurboCap and RoHS Compliant Mini-TurboCap Series are capable of conserving considerable amounts of critical board space.

Featuring an operating temperature range of -55°C to +125°C, the series' offer capacitance values of up to 82µF (for 25V parts); capacitance values of up to 39µF (for 50V parts), and capacitance values of up to 8.2µF (for 100V parts). The two series have also been life tested to 1,000 hours at 150% of the rated voltage and +125°C.

With stress-relieving lead frames, the Mini-TurboCap Series ensures the effective mechanical decoupling of the chips from the board and mitigate the stress created by board flexing, vibration, and temperature cycling. Mini-TurboCap Series capacitors and their RoHS compliant counterparts also feature 4-pin DIP construction.

Terminations for both series are available in three lead styles: straight (N), formed in (K), and formed out (M). Eliminating the risk of solder reflow during assembly to the board, lead frames for both series are attached to the chips with high temperature solder.

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