Heat sink device provides non-inductive, high heat dissipation

Posted By : Mick Elliott
Heat sink device provides non-inductive, high heat dissipation

A heat sink device with enhanced power size ratio, high stability and optimum heat dissipation from Tepro has been introduced by distributor New Yorker Electronics. Typical applications for the TO-220 Non-Inductive, Thick-Film Heat Sink Resistor are switching power supplies and various types of pulse circuits.

The Tepro TO-220 is a miniature device that features a plated copper heat sink, a high stability thick-film element and tinned copper leads. It also has high temperature thermoset moulding.

Custom models are available with variations in lead length, tolerance to 0.5%, and temperature coefficients. It is terminal strength tested at a 5lb. pull and its solderability and solvent resistance meet MIL-STD-202 requirements.

Many of Tepro’s precision and power resistors are custom designed and have the ability to meet very tight tolerances and even tighter lead times – including custom magnetics, microwave, resistors and wound film capacitors.

New Yorker is franchise distributor for Tepro/Vamistor, Divisions of Electro Technik Industries (ETI), and offers its full line of Heat Sink devices as well as its Low Ohm Current Sensing Resistors, Metal Film Discrete Resistors, Thick Film Resistors & Heat Sink Devices, Thin Film Networks and Thick Film Networks. Through the Vamistor division they also offer High Voltage Metal Alloy Resistors and a line of RL42 carbon film resistors.


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