Capacitor exhibits high CV performance in a thin package

6th February 2015
Source: AVX
Posted By : Siobhan O'Gorman
Capacitor exhibits high CV performance in a thin package

The 1206-06 D case TACmicrochip capacitor, which is claimed to be the world’s smallest, has been released by AVX. Measuring 3.4x1.8x0.6mm, the 47μF 8V device is smaller than the company’s 1206 V case capacitor. Alongside immunity to piezoelectric noise, and higher stability, reliability and temperature performance than comparable MLCCs, the capacitor exhibits high CV performance in a thin package. 

The device is suitable for use in audio and power amplifier modules, and as a coupling/decoupling capacitor in handheld electronics.The 1206-06 TACmicrochip capacitor, which can be embedded in 0.8mm-thick PCBs or thin handheld devices, is suitable for embedded electronics applications, including NFC systems and smart cards such as bank cards, SIM cards, identification cards and access control cards.

To achieve the high levels of mechanical tolerance required for miniature devices, the capacitor is manufactured using a tantalum wafer process. Featuring an enhanced internal construction, the device eliminates the space-consuming elements of conventional molded J-leaded tantalum capacitors, including the anode wire, lead frame and the need for larger wall thicknesses. Rated for use in temperatures spanning -55 to +125°C, the 1206-06 TACmicrochip is supplied with lead-free, 100% tin terminations.

“The thin and flat D case TACmicrochip capacitor is our latest response to the industry’s steady demand for higher volumetric efficiency. Despite the on-chip integration of many components, passive discrete components still occupy a majority of board space in PCB designs; hence, we are now penetrating the PCB with a new generation of embeddable components,” said Mitch Weaver, member of the technical staff, AVX. “Tantalum technology provides far greater mechanical robustness than other capacitor technologies, which allows us to create extremely small, thin, mechanically robust, and electrically stable designs that exhibit the high capacitance and long lifecycle performance necessary to enable next-gen boards and applications.”


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