Passives

Broadcom Enables Massive Network Scalability with World's Highest Density 100GbE Switch Solution

1st May 2012
ES Admin
0

Broadcom Corporation today introduced the BCM88650 series, the world's highest density 100 gigabit Ethernet (GbE) switching solution, enabling the design of switching platforms with densities up to 4,000 100GbE ports. With the industry's highest level of integration, the BCM88650 system on chip (SoC) combines the features and functionality of a complete line card into a single chip.

Together with Broadcom's leading FE1600 (BCM88750) fabric, the BCM88650 SoC enables a new generation of high density networking solutions exceeding 100 terabits per second (Tbps).

As the popularity of social networking, streaming video and high bandwidth business services continue to climb, demand for higher-speed networks is growing at an astounding pace. As a result, scalable and affordable 100GbE platforms are a key requirement for next generation switching infrastructures. Large data centers with thousands of servers require 100 Gbps network connectivity in the core to the edge, while large service provider networks require high density core switching platforms with 100 Gbps interfaces to support the increasing access capacities such as 10G PON. The BCM88650 series is the only merchant silicon solution that can process a single stream of 200Gbps traffic at Layer 2-Layer 4 with integrated advanced packet classification and deep-buffer traffic management features to support data center, carrier Ethernet and packet transport requirements.

Analysts expect 100GbE technology to significantly outpace the growth of 40GbE in its first years of introduction. In many ways, 40G has acted as a trailblazer for 100G, reducing risk at the component level and familiarizing service providers and test equipment vendors with coherent networking(1).

Unparalleled Integration Reduces Board Space, Power and System Cost
The unparalleled integration of the BCM88650 allows OEMs to reduce board space and power while lowering system costs. The unified infrastructure enables system vendors to build a single, scalable product line sharing the same switching infrastructure to address a variety of densities and applications.

A carrier access switching solution with a total capacity of a few hundred Gbps can be designed with a single BCM88650 device. A chassis with a total capacity of 25Tbps can be designed for the core of the data center or the carrier core network. Moreover, multiple chassis of different capacities can be interconnected to create a scalable core platform and deliver up to 4,000 wire-speed ports of 100GbE or their 40GbE/10GbE equivalent.

Market Drivers:
• Global IP traffic expected to grow 20-fold by 2016(1)
• 1 million minutes of video content will cross the network every second by 2015(1)
• The number of devices connected to IP networks will be 2x the global population by 2015(1)
• Massive traffic growth challenges current network architecture(3)
• 10/40/100 GbE revenues are expected to reach approximately $50B by 2015(2)

Key Facts:

•Integrates advanced packet classification, deep-buffer traffic manager, and cell based fabric interface
•Integrated 1/10/40/100GbE network interfaces eliminates the need for additional components
•Programmable packet classification engine with built-in support for data center, metro Ethernet
and transport applications
•Large on-chip classification databases can be extended using a companion Broadcom/NetLogic processor
•Deep buffers with distributed scheduling scheme allowing state of the art hierarchical QOS, transmission scheduling and flow control schemes
•Fully compatible with Broadcom's industry-leading XLP® multi-core processors and NL8865x knowledge-based processors for best-in-class control plane and expanded L2-4 header processing performance
•Fully supported by Broadcom's common Application Programming Interface (API)

Availability:
The BCM88650 series consists of multiple variations, each tailored for a specific market segment or application including data center, enterprise, carrier access, metro Ethernet, and transport applications. All devices are now sampling with production volume slated for the second half of 2012.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier