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One of the more exciting aspects of the emerging new space market is the launch of high-volume low Earth orbit (LEO) satellites that are small and economically feasible, but also radiation-tolerant and reliable. These satellites enable expanded communication and connectivity around the world. |
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Paige West speaks with Jaime Alcantara, Senior Product Manager, Sonatus about how over-the-air updates are evolving for software-defined vehicles. |
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Microsoft has unveiled Majorana 1, a quantum chip that promises a significant leap forward in the development of large-scale, fault-tolerant quantum computing. The company claims that this breakthrough could accelerate the arrival of practical quantum computers from decades to just a few years - a stark contrast to the words of NVIDIA's CEO earlier this year. |
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This guide is a valuable reference that contains all of the necessary information to get started with C2000 real-time Microcontrollers (MCUs). It covers all aspects of development with C2000 devices from hardware to support resources. In addition to key reference documents, each section provides relevant links and resources to further expand on the information covered. |
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Cincoze will showcase its full range of embedded computing solutions at embedded world 2025 (Hall 1, Booth No.: 1-407) in Nuremberg, Germany, on March 11-13. |
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Kontron has announced that it has secured a major contract for 5G automotive IoT connectivity modules for several global automotive manufacturers (OEMs). |
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SICK has brought a new safety solution to the market with its End of Arm Safeguard (EOAS) for collaborative robots (cobots). The first of its kind, the EOAS enables closer collaboration between robots and humans. |
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eSOL announces that it has entered into a partnership with Intron Technology to realise next generation software-defined vehicles (SDVs) in the Chinese market. eSOL supplies real-time operating system (RTOS) platform products that offer high levels of safety and scalability together with efficient development tools. |
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KIOXIA and Sandisk have pioneered a state-of-the-art 3D flash memory technology with a 4.8Gb/s NAND interface speed, superior power efficiency, and heightened density. Unveiled at ISSCC 2025, the 3D flash memory, together with the companies’ CBA (CMOS directly Bonded to Array) technology[1], incorporates one of the latest interface standards, Toggle DDR6.0 for NAND flash memory, and leverages the SCA (Separate Command Address) protocol[2], and PI-LTT (Power Isolated Low-Tapped Termination) technology[3], which is instrumental in further reducing power consumption. |
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Supercaps, also known as supercapacitors, are a special type of energy storage device that combine certain properties of rechargeable batteries with those of capacitors. |
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