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| Halbleiter Ankündigungen müssen nicht zwangsläufig eine Produktneugestaltung zur Folge haben Die Obsoleszenz von Komponenten muss nicht zwangsläufig ein neues Produktdesign bedeuten. Unsichere Marktbedingungen ändern immer die besten Geschäftspläne. Produktabkündigungen, Erweiterungen der Produktlebensdauer und verzögerte Produkteinführungen können zu einem Mehrbedarf bestimmter Komponenten führen. Wie kann ein Kunde diese Risiken proaktiv minimieren und wertvolle Entwicklungsressourcen einsparen? In diesem Webinar wird Rochester Electronics Folgendes erläutern: |
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| This reference design is a high-voltage analog input module with eight channels. Each channel can be used for both voltage and current measurement. |
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| UltraRAM, a pioneering memory technology, is poised to redefine the landscape of digital electronics, from smartphones to data centres. |
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| The Federal Department of Foreign Affairs (FDFA) and ETH Zurich, in collaboration with their international partners, are launching the International Computation and AI Network (ICAIN) at the World Economic Forum (WEF) 2024 in Davos. |
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| The cellular Internet of Things (IoT) ecosystem is on the cusp of a significant transformation by 2030, a change propelled by the emergence of 5G technologies, as highlighted in recent Omdia research. |
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| The automotive industry stands on the cusp of a monumental shift, with consumers increasingly voicing their preference for advanced driver-assistance systems (ADAS) and autonomous driving features in future vehicles. |
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| SWIO, a full charging management solution provider for electric and plug-in hybrid vehicles, and EVBox, a specialist provider of electric vehicle (EV) charging solutions in Europe, are joining forces to provide drivers with the fastest charging stations in Luxembourg to date. |
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| Renesas has introduced the DA14592 Bluetooth Low Energy (LE) System-on-Chip (SoC) representing Renesas’ lowest power consumption and smallest, multi-core (Cortex-M33, Cortex-M0+), Bluetooth LE device. |
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| 3D printing is a digital manufacturing technology, meaning that a large part of the production process is managed online. However, finishing the printed components still has some manual process steps. |
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| CUI Devices' Thermal Management Group announced the addition of ac fans to its product portfolio. The CAF family is a range of ac axial fans offering frame sizes of 120 mm or 172 mm and airflows from 44.69 to 164.5 CFM. |
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